Our product portfolio includes wafer grinders, polishers, dicing saws, plasma cleaners, die bonders, wire bonders, molding systems, test handlers, and a full range of supporting equipment, delivering high-performance equipment and customized solutions for semiconductor packaging and testing applications.
With exports to more than 40 countries and regions and over 200 successful global project implementations, we provide 24/7 technical support and after-sales service, striving to be a trusted partner for the global semiconductor industry.









