semi automatic wire bonder

The HY-WB900 Deep Access Wedge Wire Bonder is designed for chip-to-pin interconnection in advanced electronic component packaging. It supports hybrid circuits, COB, MCM, MEMS, RF, optoelectronic and automotive modules, featuring real-time bonding deformation monitoring, ultrasonic energy feedback, precise loop control and consistent tail wire management.

HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.