Molding Equipment

HY-PM-TO252 Semiconductor Molding Mold is designed for post-process encapsulation of integrated circuits, semiconductor devices, optoelectronic components, optocouplers and sensors. It supports a wide range of package types and features a drawer-type quick-change mold box, balanced runner design and short-distance molding for high resin utilization, stable molding quality and easy maintenance.

HY-PM252-6R professional MGP plastic sealing mold is custom-made for TO252-6R lead frame encapsulation. Featuring 6 mold boxes that process 12 lead frames per molding cycle, it fits all 550T and above plastic sealing presses. Constructed from DC53, ASP23 and tungsten steel with chrome-plated cavities, it is equipped with multi-zone temperature control and a quick-change structure. It delivers stable performance for mass IC packaging production and comes with fully interchangeable spare parts.

HY-PM220 is a TO220 MGP encapsulation mold featuring 320 cavities and 4 interchangeable mold cassettes, compatible with 450-ton and above molding presses. It adopts hard chrome plated cavities to maintain stable performance up to 100,000 shots, offering high-precision molding for semiconductor power device packaging with complete supporting spare parts.

 HY-PMS03 MGP molding mold fits SMA, SMB, SMC surface mount diodes and works with 400T+ molding presses. Each package has 4 mold boxes to form 8 lead frames at once. With quick swap mold boxes and chrome-coated wear-resistant alloy cavities, it reaches 200,000 shots. Plastic offset ≤0.05mm avoids overflow, bubbles and voids for steady mass production.

HY-PM23 MGP plastic molding die is customized for SOT23-20R semiconductor packaging. It is equipped with 6 mold boxes; each mold box holds 2 lead frames, with a total of 12 lead frames per full mold. All mold boxes and internal components are fully interchangeable and feature a quick disassembly and replacement structure.

HY-AU400 is an integrated machine serving as professional auxiliary equipment for IC plastic molding molds. It realizes automatic lead frame preheating and molding compound pellet arrangement. Fitted with robotic arms and multi-point temperature control, it adapts to all IC packaging varieties, reduces manual contamination, lifts production efficiency, and supports optional MES system networking.

HY-MF300 is auxiliary equipment for plastic packaging molds, capable of one-time removing runner and gate residual flash for all IC packages. Equipped with Mitsubishi/Yonghong PLC control and full safety interlocks including light curtain, door sensor, E-stop and two-hand buttons, it delivers stable performance and universal compatibility for all semiconductor packaging production lines.

HY-PM252-6R Molding is a high-precision molding mold designed for TO252-6R package products. The mold features a universal mold base capable of accommodating 6 mold boxes with quick mold box change design, utilizing a bottom-to-top multi-pot injection design driven by four built-in high-temperature-resistant, leak-proof hydraulic cylinders with a balanced injection head drive plate.

The HY-GD001/HY-GD803/HY-GD001A Automatic Degating Machine is designed for removing gates and runners from molded semiconductor leadframes. It combines precise punching, automatic air blowing and waste collection, while the mistake-proof mold and safety light curtain ensure reliable and safe operation.

HY-PS8120 Molding System is a fully automatic molding system designed for semiconductor packaging, supporting a wide range of package types including SOT, SOP, TOLL, TO, QFN, DFN, and BGA.

HY-LB200 Optoelectronic Drying Oven is designed for baking and drying electronic and hardware products at temperatures below 200°C. Equipped with PID temperature control, adjustable air circulation, timing settings, and multi-level over-temperature protection, it ensures stable and reliable operation. The stainless-steel chamber offers excellent durability and corrosion resistance, making the oven especially suitable for LED diodes, digital displays, backlights, and similar optoelectronic products.

HY-PS8180 Fully Automatic Semiconductor Molding System is designed for efficient encapsulation of ICs and power devices, ensuring stable quality and reliable protection.