Semiconductor R&D Equipment

The HY-TM200 Semiconductor Metallurgical Measuring Microscope combines optical observation, digital imaging, and precision measurement. It supports bright-field and dark-field inspection with positioning accuracy up to ±0.1 μm. The system is suitable for measuring gold balls, wire loops, IC packages, PCBs, and other electronic components in quality control and R&D applications.

HY-PT8600 Wire Bond Pull Test Machine performs wire pull, solder joint thrust, chip shear and BGA fatigue testing.

HY-PT8500 Push-Pull Tester is a high-precision multi-function push-pull tester designed for large-size PCB testing, Mini LED panel testing, and large-size sample testing.

HY-PT8100 Bond Tester is a multi-function manual push-pull force tester designed for comprehensive mechanical testing in semiconductor and electronic packaging applications.

HY-PT800 Bond Tester is a carrier tape adhesion force tester designed for real-time monitoring of tape loading processes, featuring a high-precision dynamic sensing system with testing accuracy of ±0.25% and a sensor range of 0–500g (customizable with other ranges upon request).

HY-WE2002M Manual Wafer Expander machine is designed for die expansion processes in LED, transistor, integrated circuit, and other semiconductor device production. It integrates heating, film stretching, wafer expansion, and film fixing into one process, with adjustable temperature, expansion time, and return speed for stable and efficient operation.

HY-WE1130 Semi-automatic Wafer Expander is designed for 6-inch dicing tape processing. It uses electric heating to soften the tape and achieve uniform, flat wafer expansion. Manual loading, automatic waste film cutting and collection, safety light curtain protection, and dual-button operation ensure efficient and safe production.

HY-PT6000 Wire Bond Pull Tester is designed for dynamic mechanical testing in semiconductor packaging, LED, SMT, BGA, automotive electronics, and sensor manufacturing. It supports pull, shear, and pull-out testing of bonding wires, solder balls, chips, ribbons, and pins, providing reliable evaluation of bonding strength and process quality.

HY-HW3018 Ultrasonic Heavy Wire Bonder is used for internal lead bonding of medium- and high-power transistors, MOSFETs, various power modules, high-current fast recovery diodes, Schottky diodes, thyristors, IGBTs, and other special semiconductor power devices.

HY-GB2012 Gold Ball Wire Bonder is mainly used for internal lead bonding of high-power LEDs, laser diodes, small and medium power diodes, transistors, integrated circuits, sensors, and special semiconductor devices. It is especially suitable for wire bonding of high-power LED devices.

HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.