AOI Inspection Machine Supplier, Factory Price AOI Inspection Machine

AOI Inspection Machine is widely used in the semiconductor industry and the electronics manufacturing. It detects the appearance defects of electronic components through advanced optical imaging technology.

Our AOI inspection Machines are suitable for IC packaging, LED manufacturing, semiconductor devices, Power devices, and electronic component inspection applications.

AOI Inspection Equipment for Semiconductor Packaging Applications
HY-BI300R Aoi Test is an advanced 2D+3D integrated AOI inspection platform designed for high-end semiconductor packaging applications, combining wire bond and die surface inspection with height-sensitive 3D measurement capabilities.
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High Performance Wire Bonding & Chip Appearance Inspection Machine
HY-BI300P Aoi Machine is equiped with Post Semiconductor Packaging 2D+3D Full Dimension Quality Control Equipment covers all defects in wire bonding (gold wire / aluminum wire bonding) and chip appearance.
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Fully Automatic Chip Appearance Inspection System for semiconductor packaging
HY-BI300 Aoi Equipment is a fully automatic 2D AOI inspection system engineered for semiconductor back-end quality assurance, addressing wire bonding and die surface defects across SIP, COB, IC, power devices, optical communication, and LED packaging applications.
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