Wire Bonder

The HY-WB500 High Precision Ultrasonic Wire Bonder is a standard planar wire bonding system designed for precision semiconductor and electronic component packaging. It features programmable auto-focus optics, dual-frequency transducer, automatic material handling, high-rigidity workholder and reliable motion control for stable and efficient bonding performance.

The HY-WB600 Gold Wire Bonder is designed for internal chip-to-pin interconnection in special electronic components such as discrete devices, microwave devices, lasers and optical communication devices. It supports customized workholders, stable ultrasonic output, gold wire bonding and stud bumping, with optional alloy, copper and silver wire processes.

The HY-WB900 Deep Access Wedge Wire Bonder is designed for chip-to-pin interconnection in advanced electronic component packaging. It supports hybrid circuits, COB, MCM, MEMS, RF, optoelectronic and automotive modules, featuring real-time bonding deformation monitoring, ultrasonic energy feedback, precise loop control and consistent tail wire management.

The HY-WB800 Fully Automatic Deep Access Wire Bonder is designed for internal chip interconnection in advanced electronic packaging. It is widely used in hybrid circuits, MCM, MEMS, RF, microwave, optoelectronic, and automotive modules. It features real-time bonding and ultrasonic monitoring, precise loop control, EFO system, and high-stability wire feed for reliable high-end applications.

The HY-WB400/HY-WB400P Wire Bonding Machine is a tilting and rotatable workholder wire bonding system designed for multi-planar interconnection in optical communication device packaging. It features automatic material handling, customizable fixtures, programmable optical path, and a high-precision XYZR direct drive system. With fast changeover and PR Look Ahead, it delivers high UPH and efficient production performance.

The HY-WB700/HY-WB700P Fully Automatic Ball Wire Bonder is a standard planar wire bonding system designed for high-precision semiconductor packaging applications. It supports customizable rails, fixtures, and magazines. Equipped with dual-frequency transducer, auto-focus optical path, advanced motion control, and multi-stage EFO system, it ensures stable, efficient, and highly reliable bonding performance.

HY-HW300 Full-Automatic Heavy Wire Bonder is designed for chip interconnection in advanced electronic components, widely used in power modules for EVs, renewable energy, rail transit, medical and aerospace systems. It features real-time bonding deformation and ultrasonic energy monitoring, closed-loop loop control, non-destructive testing, and high-precision automatic calibration for stable and reliable performance.

HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable bonding performance.

HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.

HY-BW830 Wire Bonder is an aluminum wire bonding system designed for power module assembly, primarily used for lead connection between batteries and bus bars, supporting aluminum wire diameters of 125–500 μm.