Wafer Processing Equipment

HY-WD1202 adopts imported RPS spindles, NSK precision transmission parts and Renishaw encoders for Y-axis closed-loop control with high positioning accuracy. It supports NCS height measurement, BBD blade detection, auto image recognition and on-wheel dressing, suitable for silicon, SiC/GaN wafers, ceramics, PCBs and optical glass. Applied to precision dicing for IC, power device and LED industries, the touchscreen machine has full pressure and temperature alarm protection. It offers multiple cutting modes for regular and complex workpieces, fitting for mass production in constant-temperature clean rooms.

HY-WD802 comes with dual imported high-speed spindles, coaxial & ring dual vision, built-in NCS height measurement, BBD detection and on-wheel dressing. Equipped with NSK transmission and Renishaw closed-loop linear scale for excellent positioning precision, it performs precision cutting on silicon, SiC, GaN and compound wafers for power device, IC and optoelectronic ceramic mass production.

HY-WD681 provides micron-precision cutting for 6/8-inch wafers, ceramic and glass substrates. Built with auto CCD vision alignment and high-speed adjustable spindle, it saves cleanroom space while boosting production stability and throughput, ideal for semiconductor mid-process singulation & Mini LED manufacturing.

HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.

HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.

HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.

HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.

HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.

HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.

HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.

HY-WT9330 is equipped with one air-bearing grinding spindle and two air-bearing workpiece spindles. It can process various ultra-hard, brittle and hard-to-grind substrates up to 12 inches, enabling high-efficiency, damage-free and ultra-precise mirror grinding with outstanding thickness accuracy, suitable for the back thinning process of all types of chip wafers.

HY-WT9530 is fitted with 2 air-bearing spindles and 3 vacuum chuck tables for hard brittle substrates up to 8-inch. Operators only need to load cassettes manually, while the machine completes full automatic cycles including rough/fine grinding, cleaning and recovery. Post-grinding TTV≤1.5μm with excellent flatness and surface roughness, suitable for backside thinning of various semiconductor wafers.