Soldering & Dispensing & Screwing Equipment

The HY-DM300 Pneumatic Dispensing Machine is specifically designed for multi-chip fully automatic dispensing processes in the packaging of electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing.

This HY-AP8700 Manual Glue Dispenser is designed for accurate metering, mixing and dispensing of various A/B adhesives. With PLC-controlled metering motors, vacuum loading, degassing, heating, stirring and automatic cleaning functions, it provides stable and cost-effective dispensing performance for PCB, electronic components, lighting, automotive accessories and other industries.

HY-AP3030 Auto Glue Dispenser  is designed for precise A/B glue proportioning, mixing and quantitative dispensing. Equipped with a proprietary motion controller and high-precision three-axis manipulator, it delivers stable, accurate and efficient dispensing performance for PCB, electronic components, lighting, automotive accessories and other industries.

HY-TP700 Precision AB Glue Dispenser is designed for accurate A/B glue proportioning, mixing and quantitative dispensing. With an industrial PC, advanced motion control system and high-precision three-axis robotic arm, it delivers stable and efficient dispensing performance for PCB, electronic components, automotive accessories, lighting products and other applications.

HY-CUS03 Automatic Push-Pull Glue Dispensing and Sorting System is an automatic push-pull glue dispensing and sorting system specifically designed for SMA, SMB, and SMC package products.

HY-PU001 Sealant Dispensing Machine processing machine is an automatic push-pull glue dispensing and sorting system specifically designed for TO252-6R package products. 

HY-PU001A Epoxy Dispensing Machine is an automatic push-pull glue dispensing and sorting system specifically designed for TO220 package products. 

HY-VI8 Vacuum Soldering Furnace is a fully automatic inline vacuum soldering furnace specially optimized for lead frame products and power devices in the semiconductor industry, supporting PDFN, QFN, SMA, TO220, and TO3P packages.

HY-PM400 Fully Automatic Vacuum Potting Machine combines vacuum degassing, precision metering, dynamic mixing, three-axis dispensing and automatic cleaning. It automatically dispenses two-component adhesives under adjustable vacuum conditions to reduce bubbles and voids, making it suitable for automotive electronics, capacitors, coils, transformers, relays and power modules.

HY-TP3030 Automatic Two-component Potting Machine combines a precision metering system with a high-accuracy three-axis motion platform to automatically meter, mix and dispense two-component adhesives. With vacuum feeding and degassing functions, it is suitable for automatic dispensing, potting and sealing of various electronic products.

HY-PM3030 is an inline automatic two-component potting machine integrating conveyor transfer, precision metering, adhesive mixing and three-axis dispensing. It supports vacuum material feeding and degassing and can be connected with transfer conveyors, curing ovens and other automation equipment for potting, sealing and insulation of circuit boards, electronic components, automotive electronics, lighting products and small appliances.