Inspection & Testing Equipment

HY-XRB8101 fast 3D CT X-Ray system adopts X-ray penetration to complete non-destructive Open Hole (OH) flaw inspection for laminated power cell corners. Multi-angle scanning generates complete 3D volumetric data, and built-in AI algorithms realize automatic defect judgment to stabilize quality control during mass new energy cell manufacturing.

HY-XR8001 supports offline scanning and imaging for product Regions of Interest (ROI). Following 3D reconstruction, our dedicated visualization analysis software delivers accurate analytical measurement. Ideal for in-process quality control, failure analysis and laboratory research, the system performs fully non-destructive testing to visualize internal product structures and hidden defects, with complete measurement and analytical capabilities.

HY-XR5010(2.5D) Series performs non-destructive testing for IC packaging, BGA/QFN chips, PCBA and capacitors. Equipped with CNC motion, multi-angle imaging and one-click void analysis, it detects voids, solder faults and dimensional errors. Three models fit small-batch checks, production sampling and lab R&D; optional barcode tracking and a high-res detector spot defects as tiny as 4μm. Full enclosed lead shielding limits radiation below 1μSv/h, with complete official radiation safety certifications.

HY-XR5010A  (2D) Series detects invisible internal flaws of industrial workpieces. It integrates micro-focus ray source, high-definition flat-panel imaging and CNC automatic inspection functions, equipped with reliable radiation protection design, suitable for offline quality control of medium-volume production lines across multiple manufacturing sectors.

HY-BI300R Aoi Test is an advanced 2D+3D integrated AOI inspection platform designed for high-end semiconductor packaging applications, combining wire bond and die surface inspection with height-sensitive 3D measurement capabilities.

HY-BI300P Aoi Machine is equiped with Post Semiconductor Packaging 2D+3D Full Dimension Quality Control Equipment covers all defects in wire bonding (gold wire / aluminum wire bonding) and chip appearance.   

HY-BI300 Aoi Equipment  is a fully automatic 2D AOI inspection system engineered for semiconductor back-end quality assurance, addressing wire bonding and die surface defects across SIP, COB, IC, power devices, optical communication, and LED packaging applications.