wire bonding equipment

The HY-WB600 Gold Wire Bonder is designed for internal chip-to-pin interconnection in special electronic components such as discrete devices, microwave devices, lasers and optical communication devices. It supports customized workholders, stable ultrasonic output, gold wire bonding and stud bumping, with optional alloy, copper and silver wire processes.

The HY-WB800 Fully Automatic Deep Access Wire Bonder is designed for internal chip interconnection in advanced electronic packaging. It is widely used in hybrid circuits, MCM, MEMS, RF, microwave, optoelectronic, and automotive modules. It features real-time bonding and ultrasonic monitoring, precise loop control, EFO system, and high-stability wire feed for reliable high-end applications.

The HY-WB700/HY-WB700P Fully Automatic Ball Wire Bonder is a standard planar wire bonding system designed for high-precision semiconductor packaging applications. It supports customizable rails, fixtures, and magazines. Equipped with dual-frequency transducer, auto-focus optical path, advanced motion control, and multi-stage EFO system, it ensures stable, efficient, and highly reliable bonding performance.

HY-HW300 Full-Automatic Heavy Wire Bonder is designed for chip interconnection in advanced electronic components, widely used in power modules for EVs, renewable energy, rail transit, medical and aerospace systems. It features real-time bonding deformation and ultrasonic energy monitoring, closed-loop loop control, non-destructive testing, and high-precision automatic calibration for stable and reliable performance.

HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.

HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires. 

HY-HW3018 Ultrasonic Heavy Wire Bonder is used for internal lead bonding of medium- and high-power transistors, MOSFETs, various power modules, high-current fast recovery diodes, Schottky diodes, thyristors, IGBTs, and other special semiconductor power devices.

HY-GB2012 Gold Ball Wire Bonder is mainly used for internal lead bonding of high-power LEDs, laser diodes, small and medium power diodes, transistors, integrated circuits, sensors, and special semiconductor devices. It is especially suitable for wire bonding of high-power LED devices.

HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.