Trim Form Equipment

This HY-TFC100 Semiconductor Trim and Form Machine is designed for lead trimming, forming and singulation after product encapsulation. Suitable for SOP and SSOP packages, it features PLC control, servo motor drive, continuous magazine loading, automatic tube unloading and multiple safety protections, ensuring stable and efficient post-molding processing.

HY-TF200D is dedicated post-mold punching equipment for semiconductor packaging lines, integrating lead trimming, pin forming and component singulation in one automatic cycle. It supports SOT, EMC, TO, DIP and optocoupler packaging with an adjustable punching speed of 60–100 SPM. This machine is standard fitted with Mitsubishi/Yonghong PLC, servo-driven power system and complete safety protection. CCD visual inspection and MES system networking can be optionally equipped to meet intelligent digital packaging workshop demands.

HY-TF200L adopts dual lower flywheel stamping system for semiconductor post-molding lead frame trimming, forming & singulation, compatible with SOT, TO, SOP and DIP packages. It runs 80–120 strokes per minute with PLC control and full safety interlocks, supporting optional CCD visual inspection and MES system networking. Comes with full series precision mold spare parts, it meets mass IC packaging production requirements.

HY-TF200U is specially designed for post-molding lead trimming, forming and separation of semiconductor packaging components. Compatible with SOT, TO, SOP, DIP, IPM, photovoltaic modules & optocouplers. Equipped with full servo drive system, dual magazine non-stop feeding, safety light curtain protection, optional CCD visual inspection and MES networking function, punching speed up to 30–60 SPM, stable high-efficiency mass production solution for IC packaging industry.

HY-TF100 is designed for post-mold semiconductor IC lead trimming, pin forming and singulation. Compatible with mainstream miniature packages including SOT, SOD, TSOT and PDFN, it delivers a punching speed of 120–200 SPM. Featuring servo feeding and dual non-stop spring clamps, this equipment significantly boosts throughput of semiconductor packaging lines. It is equipped with complete safety protection as standard, while optional CCD visual inspection and MES networking are available to support smart factory digital management.

HY-TFS210 Lead Cutting Machine is an automatic trim and form system specifically designed for SMA, SMB, and SMC package products. It features a simple structure with stable and reliable performance, a small footprint, fast and stable operation, low noise, and easy operation and maintenance, significantly reducing labor intensity. 

HY-TF110 Semiconductor Post Mold Equipment  is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes. 

HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.

HY-TF210 Trim Roll Former is an automatic trim and form system specifically designed for TO252-6R package products. It delivers a throughput of ≥70k per hour with a punching stroke rate of 50–60 strokes per minute, and features MTBA of ≥40 minutes, MTBF of ≥120 hours, MTTA of ≤5 minutes, and downtime rate of ≤3%.

HY-DS30K is an high-speed integrated dicing saw developed for post-mold singulation of semiconductor molded substrates. It supports an integrated processing flow including substrate cutting, cleaning, vision inspection, sorting and tray binning, which greatly improves the production efficiency of standard semiconductor backend packaging processes.