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Xiamen Hyrnus Technology Co., Ltd. is a professional manufacturer and one-stop solution provider specializing in semiconductor equipment and industrial automation solutions. Backed by the ACEY Group, established in 2009 with 17 years of industry experience, the company operates a 10,000+ m² manufacturing facility, supported by 120+ employees and 50+ R&D engineers, integrating R&D, manufacturing, quality control, and technical services.

Our product portfolio includes wafer grinders, polishers, dicing saws, plasma cleaners, die bonders, wire bonders, molding systems, test handlers, and a full range of supporting equipment, delivering high-performance equipment and customized solutions for semiconductor packaging and testing applications.

With exports to more than 40 countries and regions and over 200 successful global project implementations, we provide 24/7 technical support and after-sales service, striving to be a trusted partner for the global semiconductor industry.

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If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact us:allen@hyrnus.com