Semiconductor Equipment Suppiler | Wire Bonder

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Multi-chip Die Attach Machine Automatic Die Bonder for System-in-Package
The HY-DA300 Multi-chip Die Attach Machine is specifically designed for multi-chip fully automatic placement processes in the packaging of electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing.
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High Precision Automatic Glue Dispenser Pneumatic Dispensing Machine
The HY-DM300 Pneumatic Dispensing Machine is specifically designed for multi-chip fully automatic dispensing processes in the packaging of electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing.
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Automatic Deep-Cavity Multi-Chip Epoxy Die Bonder
HY-PB300 Fully Automatic Epoxy Die Bonder is designed for multi-chip packaging applications. It integrates precision dispensing, die placement, upper and lower vision positioning, flexible PR recognition and accurate force control, providing stable and efficient assembly for hybrid circuits, COB, MCM, MEMS, RF and optoelectronic modules.
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Epoxy Dispensing and Chip-to-Wafer Die Bonding Machine
HY-DB300 Fully Automatic Dispensing and Die Bonding Machine is a fully automatic dispensing and die bonding machine designed for high-precision multi-chip and chip-to-wafer assembly. It supports wafers up to 8 inches, chips from 0.2 × 0.2 mm to 15 × 15 mm, wafer mapping, dual-vision positioning and 3D stacking up to 5 mm. The machine achieves ±3 μm placement accuracy and a pick-and-place capacity of up to 1,200 UPH.
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High Precision Ultrasonic Wire Bonding Machine for Optical Devices
The HY-WB500 High Precision Ultrasonic Wire Bonder is a standard planar wire bonding system designed for precision semiconductor and electronic component packaging. It features programmable auto-focus optics, dual-frequency transducer, automatic material handling, high-rigidity workholder and reliable motion control for stable and efficient bonding performance.
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IC Packaging Gold Wire Bonder Flip Chip Wire Bonding Machine
The HY-WB600 Gold Wire Bonder is designed for internal chip-to-pin interconnection in special electronic components such as discrete devices, microwave devices, lasers and optical communication devices. It supports customized workholders, stable ultrasonic output, gold wire bonding and stud bumping, with optional alloy, copper and silver wire processes.
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Semiconductor Metallurgical Measuring Microscope For IC Package Inspection
The HY-TM200 Semiconductor Metallurgical Measuring Microscope combines optical observation, digital imaging, and precision measurement. It supports bright-field and dark-field inspection with positioning accuracy up to ±0.1 μm. The system is suitable for measuring gold balls, wire loops, IC packages, PCBs, and other electronic components in quality control and R&D applications.
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IC Packaging Testing Wire Bond Pull Test Machine
HY-PT8600 Wire Bond Pull Test Machine performs wire pull, solder joint thrust, chip shear and BGA fatigue testing.
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Fully Automatic Trim Form Separation System with Automatic Tube Unloading System
This HY-TFC100 Semiconductor Trim and Form Machine is designed for lead trimming, forming and singulation after product encapsulation. Suitable for SOP and SSOP packages, it features PLC control, servo motor drive, continuous magazine loading, automatic tube unloading and multiple safety protections, ensuring stable and efficient post-molding processing.
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TO MGP Molding Mold for Semiconductor Devices
HY-PM-TO252 Semiconductor Molding Mold is designed for post-process encapsulation of integrated circuits, semiconductor devices, optoelectronic components, optocouplers and sensors. It supports a wide range of package types and features a drawer-type quick-change mold box, balanced runner design and short-distance molding for high resin utilization, stable molding quality and easy maintenance.
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Epoxy Mixing and Dispensing Machine Manual Glue Dispenser for PCB
This HY-AP8700 Manual Glue Dispenser is designed for accurate metering, mixing and dispensing of various A/B adhesives. With PLC-controlled metering motors, vacuum loading, degassing, heating, stirring and automatic cleaning functions, it provides stable and cost-effective dispensing performance for PCB, electronic components, lighting, automotive accessories and other industries.
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Auto Glue Dispenser Liquid Glue Dispensing Equipment
HY-AP3030 Auto Glue Dispenser is designed for precise A/B glue proportioning, mixing and quantitative dispensing. Equipped with a proprietary motion controller and high-precision three-axis manipulator, it delivers stable, accurate and efficient dispensing performance for PCB, electronic components, lighting, automotive accessories and other industries.
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One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Products

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration