Polishing Machine Supplier, Factory Price Polishing Machine

Wafer Polishing Machine is specialized equipment employed in semiconductor manufacturing processes to conduct ultra-precise planarization of wafer surfaces.

Our wafer polishing equipment is suitable for sapphire substrates, GaN wafers, optical glass wafers, SiC substrates, sapphire epitaxial wafers, silicon wafers, ceramic tiles, quartz crystals, and other semiconductor materials.

Fully Automatic Wafer Grinding and Polishing Machine for Semiconductor Packaging
HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.
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Single-Side Precision Copper Polishing Machine with PLC Touch Control and Disc Conditioner
HY-SP855 single-side copper polisher handles precision lapping and polishing for semiconductor hard brittle materials. It adopts PLC touch control and built-in disc conditioner, featuring variable frequency drive, closed-loop pressure control and plate water cooling. The conditioned plate flatness reaches 0.01mm, delivering stable, uniform processing for high-precision substrate mass production.
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Single-Side Wafer CMP Polishing Machine for Semiconductor Substrates
The HY-SP910 is equipped with PLC & touchscreen control system for simple setup, easy operation and stable performance. It performs ultra-precise single-sided polishing on thin components, supporting semiconductor substrates (sapphire, SiC, silicon & epitaxial wafers) as well as optical glass wafers, quartz crystals, ceramic wafers, stainless steel workpieces and fiber-optic connectors.
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