Die Bonder

The HY-DA300 Multi-chip Die Attach Machine  is specifically designed for multi-chip fully automatic placement processes in the packaging of electronic components and is recognized as one of the key pieces of equipment in electronic component manufacturing. 

HY-PB300 Fully Automatic Epoxy Die Bonder is designed for multi-chip packaging applications. It integrates precision dispensing, die placement, upper and lower vision positioning, flexible PR recognition and accurate force control, providing stable and efficient assembly for hybrid circuits, COB, MCM, MEMS, RF and optoelectronic modules.

HY-DB300 Fully Automatic Dispensing and Die Bonding Machine is a fully automatic dispensing and die bonding machine designed for high-precision multi-chip and chip-to-wafer assembly. It supports wafers up to 8 inches, chips from 0.2 × 0.2 mm to 15 × 15 mm, wafer mapping, dual-vision positioning and 3D stacking up to 5 mm. The machine achieves ±3 μm placement accuracy and a pick-and-place capacity of up to 1,200 UPH. 

HY-UTB600 is a high-precision automatic ultrasonic welding equipment specially developed for power semiconductors, copper substrates, terminal wiring harnesses and busbars. It is widely applied in the welding process of metal terminals for power modules, copper lead frames and other electronic components. Featuring full automatic inline production capacity, it delivers outstanding performance in welding precision, production efficiency and low maintenance cost.

HY-UPB600 features full-process real-time monitoring of pressure, energy and welding time to guarantee stable welding quality, with fully automatic operation covering auto loading & unloading, automatic positioning and automated welding. It integrates a built-in product cleaning function, supports multi-angle welding ranging from 0° to 360°, and adopts a master-slave welding tip design that allows for fast replacement and reduces long-term consumable costs.

HY-GD4000 handles both eutectic bonding and adhesive die attach for chip packaging. Equipped with dual bond heads and dual eutectic stages, it delivers high productivity with a 12-station automatic nozzle library. The independent ZR axis ensures precise component placement and consistent bonding pressure, while programmable multi-stage heating adapts to various eutectic alloys for multi-chip and flip-chip assembly. Its integrated vision system realizes automatic high-precision positioning and post-bond quality inspection.

HY-GD3000 serves diverse adhesive chip packaging with programmable mounting. It supports in-line loading, 300×200mm fixtures, auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins, and processes up to 12-inch wafers. It features syringe & multi-glue tray dispensing, full closed-loop Z-axis force control (min 10±1g) and flip chip mounting. Dual vision enables visualized, stable & precise microchip packaging.

HY-GD800 is suitable for COB/COC multi-chip packaging processes and supports both dispensing die attach and thermal eutectic bonding. Fitted with a dual-drive gantry structure and high-precision CCD visual positioning system, its bonding head automatically switches between nozzles and dispensing tips to handle all types of chips. It accommodates standard 2-inch & 4-inch die trays, as well as 6-inch & 8-inch wafers with automatic wafer loading and unloading. An optional substrate conveyor track can be connected to external equipment to build automatic production lines. Bonding programs support custom editing to fit all customized production requirements.

HY-EBT505 is a dedicated eutectic device for TO packaging, compatible with TO56, TO9 and TO38 bases, enabling simultaneous eutectic bonding of two components on one single base. Equipped with visual positioning, linear motor manipulator and constant-temperature eutectic stage with nitrogen protection, as well as assembly line loading/unloading and vacuum pick-up detection structure, it delivers high mounting accuracy and stable process, simplifies packaging procedures and improves production efficiency and finished product yield.

HY-DD560P is dedicated production equipment for COB and COC processes. It mainly performs epoxy dispensing and die bonding between substrates (PCB or other carrier materials to be processed) and chips. Integrated with automatic loading/unloading, parallel dispensing & die picking, and multi-CCD vision positioning compensation full-automatic workflow, it enables stable high-precision die attaching and bonding, suitable for mass packaging production of optoelectronic and communication chips.

HY-MD561P is developed for COB/COC multi-chip packaging. Equipped with linear motor and CCD vision positioning system, three independent pick-and-place heads, it supports auto feeding of 6-inch wafers and 2-inch waffle packs. Built-in through vision correction; optional syringe dispensing and UV curing systems can be configured to realize chip-substrate bonding.

HY-SD8012 Die Attach Equipmentis an advanced soft solder die bonder compatible with 12"–6" wafers, featuring thin chip handling capability with accuracy and speed reaching imported-equipment levels.