SOP8 (SOIC8) IC Packaging Line Solution

June 17, 2026

A concise equipment and process solution for SOP8 integrated circuit packaging, from wafer preparation and die attach to final testing and packing.

HYRNUS configures stand-alone machines, semi-automatic lines, or integrated packaging lines according to die size, lead-frame design, bonding materials, test requirements, and target throughput.

Solution Overview

SOP8, also known as SOIC8, is a widely used eight-lead surface-mount package. Its compact size, mature manufacturing process, SMT compatibility, and efficient production make it suitable for power-management ICs, operational amplifiers, interface devices, memory products, and control ICs.

Typical Applications

Power-management ICs
Operational amplifiers
EEPROM and memory ICs
Interface and driver ICs
Sensor control ICs
Consumer and industrial electronic devices

SOP8 Packaging Process

Wafer Preparation → Wafer Dicing → Plasma Cleaning → Die Attach → Wire Bonding → Molding → Trim & Form → Testing & Sorting → AOI & Packing

Process Description

1. Wafer Preparation

The wafer is thinned and polished to the required thickness for SOP8 packaging. Key requirements include thickness uniformity, surface quality, and wafer warpage control.

2. Wafer Dicing

A precision dicing saw separates the wafer into individual dies. Cutting accuracy, edge chipping, cracks, and contamination must be controlled.

3. Plasma Cleaning

Plasma treatment removes dust, organic residues, and surface contamination from the die and lead frame, improving the reliability of die attach, wire bonding, and molding adhesion.

4. Die Attach

The die is accurately placed on the SOP8 lead-frame die pad using silver epoxy or another specified bonding material.

Die placement accuracy
Adhesive volume
Die tilt
Curing temperature and time

5. Wire Bonding

Gold wire, copper wire, or another suitable bonding material connects the die pads to the lead-frame fingers. Bond position, loop profile, force, ultrasonic energy, and bond quality must remain stable.

6. Molding

Epoxy molding compound encapsulates the die and bonding wires, providing electrical insulation, moisture resistance, and mechanical protection. A fully automatic molding system can be configured with a dedicated SOP8 mold.

7. Trim & Form

The lead-frame tie bars are removed, the packages are separated, and the leads are formed into the required gull-wing shape. Lead dimensions, pitch, coplanarity, and burrs are key control items.

8. Testing & Sorting

Finished devices undergo open/short, functional, and electrical-parameter testing. The handler automatically sorts devices by pass/fail status or electrical grade.

9. AOI Inspection & Packing

AOI checks the package body, leads, markings, and visible defects. Qualified devices can be packed in tape-and-reel, tubes, or trays.

Recommended Equipment Configuration

Process	Recommended Equipment	Main Function
Wafer Grinding	HY-TP9730 Wafer Grinding Machine	Wafer thinning and thickness control
Wafer Dicing	HY-WD681 Automatic Wafer Dicing Saw	Precision die singulation
Plasma Cleaning	HY-EI160 Vacuum Plasma Cleaner	Surface activation and contamination removal
Die Attach	HY-MD660 Die Bonder	Die pickup, alignment, and placement
Wire Bonding	HY-GB2012 Wire Bonder	Electrical interconnection
Molding	HY-PS8120 Automatic Molding System	Transfer molding and package protection
Trim & Form	HY-TF100 Automatic Trim and Form System	Lead cutting, package separation, and forming
Test & Sorting	HY-TS950 Turret Test Handler	Electrical testing and automatic sorting
AOI	HY-BI300 AOI Inspection Machine	Package, lead, marking, and surface inspection

*Final equipment selection depends on wafer size, die dimensions, lead-frame format, test time, input/output method, and target throughput.

Solution Advantages

Covers the main SOP8 packaging and testing processes.
Suitable for stable, high-volume production.
Supports stand-alone machines, semi-automatic lines, and integrated line configurations.
Selected equipment can support other SOP packages through tooling, mold, fixture, and program changes.
Installation, commissioning, trial production, and operator training can be provided.

Information Required for Project Configuration

Wafer size, die dimensions, and die thickness
SOP8 package drawing
Lead-frame drawing and strip layout
Die-attach and wire-bonding materials
Electrical test items and test time per device
Required throughput
Input, output, and packing formats
Target automation level
Factory space and utility conditions

Request a Customized SOP8 Packaging Solution

HYRNUS can configure individual machines or a complete SOP8 packaging and testing line based on your product structure, process route, production capacity, and factory conditions. Please provide your package drawing, lead-frame information, test requirements, and target output for technical evaluation.

Contact HYRNUS for a tailored SOP8 equipment configuration.