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HY-SW360 is used for mounting compound semiconductor wafers on ceramic plates prior to thinning. It features precise quantitative solid wax dispensing, independent air cylinder pressing and accurate temperature control, achieving TTV ≤0.005 mm after mounting. Composed of mechanical, pneumatic-water and electrical control subsystems, it delivers stable high-precision wax mounting for wafer thinning processes.
Brand :
HYRNUSItem No. :
HY-SW360Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSemi-Automatic Wax Mounting Machine for IC Bonding and Silicon Compound Semiconductor Wafers
Product Introduction
HY-SW360 Semi-Automatic Wax Mounting Machine performs wafer bonding onto ceramic carriers as the pre-process for single-side wafer thinning.
It adopts solid wax melting design with ±0.02g accurate fixed-quantity wax dispensing, paired with independent air cylinder compression and dual heating-cooling platforms featuring closed-loop precise temperature regulation. The finished mounting flatness reaches TTV ≤ 5 μm. Designed for 4-inch and 6-inch wafers, the unit adopts PLC centralized control and consists of integrated mechanical, pneumatic-water and electrical control subsystems, supporting stable long-term operation and consistent high-precision wax mounting for wafer back grinding.
Product Advantages
1. Adopts solid wax melting method for accurate and quantitative wax dispensing.
2. The heating and cooling chuck is equipped with a precision heating and automatic cooling system to accurately control the chuck surface temperature.
3. Adopts independent cylinder pressing with precise air pressure control, enabling accurate control of wax layer thickness.
4. TTV after mounting ≤ 0.005 mm.
Application Fields
This equipment is mainly used for mounting wafers such as GaN, GaAs, sapphire and SiC onto the surface of ceramic carriers before single-side thinning.
Key Systems of the Equipment
| System Category | Component | Specification / Brand |
| Mechanical Structure | Sheet Metal | National Standard 60×60×5 Square Tube + Industrial Grade Baking Paint Outer Frame |
| Parts | 45# Steel with Surface Hard Chrome Treatment / Stainless Steel 304 / AL6061 with Surface Anodizing Treatment | |
| Pneumatic Pressure Holding Mechanism | In-house Manufactured | |
| Heating Stage Mechanism | In-house Manufactured | |
| Transfer Mechanism | In-house Manufactured | |
| Linear Guide | THK / HIWIN / TBI | |
| Electrical Control System | PLC | Panasonic / Mitsubishi / Delta |
| Touch Screen | Weinview / Weintek / Advantech | |
| Power Protection | Leakage Circuit Breaker (Mingwei / Schneider) | |
| DC Power Supply | Switching Power Supply (Mingwei / Schneider) | |
| Pneumatic System | Air Cylinder | SMC / CKD / FESTO |
| Pressure Control | SMC / CKD / FESTO | |
| Pressure Regulation | SMC / CKD / FESTO | |
| Pressure Indication | SMC / CKD / FESTO | |
| Solenoid Valve | SMC / CKD / FESTO |
Technical Parameter
| Parameter Name | Specification |
| Model | HY-SW360 |
| Applicable Wafer Size | 4-inch / 6-inch |
| Suction Robot Stroke | 450 mm |
| Suction Robot Axis Quantity | Single Axis (3-axis design reserved) |
| Suction Robot Repositioning Accuracy | ±0.05 mm |
| Suction Robot Vacuum Pressure Range | -70 ~ -90 kPa |
| Ceramic Carrier Dimension | Φ360 × 15 mm |
| Solid Wax Service Life | 350 wafers per wax stick |
| Wax Dispenser Temperature Control Range | 40℃ ~ 130℃ |
| Operating Temperature of Wax Dispenser | 100℃ |
| Wax Dispensing Accuracy | ±0.02 g |
| Wax Dispenser Repositioning Accuracy | ±0.05 mm |
| Heating Plate Heating-up Time | 3 min |
| Heating Plate Cooling Time | 3 min |
| Heating Plate Temperature Control Range | 60℃ ~ 130℃ |
| Heating Plate Temperature Control Precision | ±0.5℃ |
| Press Cylinder Load | 100 ~ 1000 Kg @ 0.6 MPa ±1% F.S. |
| Wax Layer Uniformity | TTV ≤ 5 μm |
| General Air Supply | 0.4–0.7 MPa (Dry & Oil-free) |
| Main Control System | PLC |
| Total Power Consumption | Approx. 7 kW |
| Total Machine Weight | Approx. 1000 kg |
| Overall Dimension (L×W×H, mm) | 1550×1550×1900 (Excluding tri-color indicator light height) |
Site Facility Requirements
| Category | Item | Specification |
| Site Facilities (Auxiliary Equipment) | Power Supply | Machine Voltage: AC220V±10%, Current: 20A, Power: 1.2 KW |
| Environmental Requirements | Workshop Temperature: 15°C-25°C, Relative Humidity: ≤80% | |
| Air Supply | 0.4~0.6 MPa, Flow Rate >20 L/min, Pipe Diameter: Φ12 mm | |
| Cooling Water Supply | Inlet Water Temperature: 3~22°C, Circulating Water Flow: 15~30L/min, Circulating Water Supply Pressure: 0.2MPa |
Product Details
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