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The HY-WB400/HY-WB400P Wire Bonding Machine is a tilting and rotatable workholder wire bonding system designed for multi-planar interconnection in optical communication device packaging. It features automatic material handling, customizable fixtures, programmable optical path, and a high-precision XYZR direct drive system. With fast changeover and PR Look Ahead, it delivers high UPH and efficient production performance.
Brand :
HYRNUSItem No. :
HY-WB400 / HY-WB400POrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSemiconductor Ball Bonder Optical Communication Components Wire Bonding Machine
Product Introduction
The HY-WB400/HY-WB400P Wire Bonding Machine is a product featuring a tilting/rotatable workholder, specifically designed to better suit the multi-planar interconnection process between chips and pins in the production of optical communication components. It is recognized as one of the key pieces of equipment in the packaging and manufacturing of optical communication components.
Features
| No. | Feature |
| 1 | Efficient material handling and clamping system, automatic loading and unloading, customizable magazines and fixtures based on customer products |
| 2 | Programmable optical path system |
| 3 | Efficient and high-precision XYZR direct drive system |
| 4 | Fast product changeover, less than 30 minutes |
| 5 | PR Look Ahead function, highest production efficiency (UPH) in the market >1K @ 4-wire TO56 |
Technical Specifications
| No. | Parameter | Specification |
| 1. | Workholder (Customizable) | |
| 2. | Workholder Z Travel | 17 mm |
| 3. | Heater Temperature | Room temperature ~ 300°C |
| 4. | Workholder X-Y Range | 72 mm × 46 mm |
| 5. | Operating System | Windows |
| 6. | Bonding Travel | 60 mm × 45 mm |
| 7. | Min Bond Pad Pitch | 45 μm |
| 8. | Bonding Accuracy | ±3 μm @ 3σ |
| 9. | Wire Diameter | 18 μm ~ 50 μm |
| 10. | Max Wire Length | 7 mm |
| 11. | Min Loop Height | 60 μm |
| 12. | Loop Height Accuracy | ±25.4 μm |
| 13. | Wire Swing | ±25 μm |
| 14. | Loop Control | Fully programmable |
| 15. | Optical Path | 2~4 / 1.6~3.6 continuous zoom, programmable auto focus |
| 16. | Standard Bonding Speed | TO56 UPH >1K @ 4-wire (3 rotation loops) |
| 17. | Chip Position Tolerance | X: ±190 μm, Y: ±140 μm |
| 18. | Chip Angle Tolerance | Rotation ±45° |
| 19. | Ultrasonic Power | 0~2 W |
| 20. | Bonding Force | 0~360 g |
| 21. | Input Voltage | AC 220V ± 10% (50 Hz) |
| 22. | Compressed Air Requirement | 0.35~1 MPa, Φ10 air fitting |
| 23. | Weight | Net: 700 kg |
| 24. | Rated Air Consumption | 150 L/min @ 0.5 MPa |
| 25. | Dimensions (W×D×H) | 1250 × 950 × 2100 mm |
| 26. | Loop Modes | Q loop / S loop / BGA-Twist |
| 27. | Clamp Plate Height | 5.2 mm |
| 28. | Weldable Plane Angles | 0° / 12° / 90° / 270° |
Terms of use
| No | Item | Requirements |
| 1. | Ambient Temperature (Room Temperature) | 15°C ~ 30°C |
| 2. | Ambient Relative Humidity | 30% ~ 60% (no condensation) |
| 3. | Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 4. | Power Requirements | 1. 220V AC ± 10% |
| 2. Power ≥ 2000W | ||
| 3. Frequency: 50Hz ± 1Hz | ||
| 5. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 6. | Others | - Ensure power supply is located near the machine |
| - Precision leveling with a leveling instrument is required after installation on site | ||
| - Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination | ||
| - Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination | ||
| 7. | Voltage | 220V ± 10% |
| 8. | Frequency | 50/60Hz |
| 9. | Grounding | Must be grounded |
| 10. | Power | ≥2000W |
| 11. | Interface Specification | 10A, Single-phase 3-wire |
Product Details
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