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HY-GD4000 handles both eutectic bonding and adhesive die attach for chip packaging. Equipped with dual bond heads and dual eutectic stages, it delivers high productivity with a 12-station automatic nozzle library. The independent ZR axis ensures precise component placement and consistent bonding pressure, while programmable multi-stage heating adapts to various eutectic alloys for multi-chip and flip-chip assembly. Its integrated vision system realizes automatic high-precision positioning and post-bond quality inspection.
Brand :
HYRNUSItem No. :
HY-GD4000Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh Precision Dual Worktables Eutectic Die Bonder Suitable for 6-inch Wafer Semiconductor Packaging
Product Introduction
HY-GD4000 is a multi-functional eutectic die bonder equipped with dual worktables, supporting both eutectic bonding and adhesive die attach processes for chip packaging. Featuring dual bond heads and dual eutectic stages, this eutectic die bonder delivers significantly higher production throughput. It comes with an automatic nozzle changing system that can store up to 12 different nozzles, while an independent ZR axis ensures ultra-precise component placement and consistent eutectic bonding pressure. The eutectic bonder supports multi-segment programmable temperature heating to accommodate a wide range of eutectic alloys and works seamlessly with multi-chip eutectic workflows. A fully programmable vision recognition system enables automated high-precision positioning and post-bond quality inspection throughout eutectic packaging production.
Component List
| No. | English Name |
| 1 | Wafer System |
| 2 | Material Handling Robot |
| 3 | Chip Tray & Recovery Fixture |
| 4 | Top-view Camera |
| 5 | Eutectic Bonding Robot |
| 6 | Adhesive Tray & Calibration Structure |
| 7 | Dual Eutectic Stage & Chip Transfer Module |
Equipment Principle
Material Transfer Process Description
1. Material Loading Area: Compatible with 6-inch wafers, 2-inch & 4-inch waffle packs.
2. Secondary Material Zone: Configurable as material feeding or receiving station (without loading/unloading track). Fixtures support 2-inch, 4-inch waffle packs or 6-inch blue tapes.
3. Left Station of Eutectic Stage: The material manipulator picks chips and places them on the side platform of the eutectic stage for subsequent eutectic bonding, or retrieves finished products from the eutectic stage for collection.
4. Right Station of Eutectic Stage: The eutectic manipulator transfers chips from the intermediate platform to the eutectic stage for bonding process.
5. Loading & Unloading Track (Optional Function): Enables automatic loading and unloading of spring clip carriers such as fish frame fixtures.
Process Flow
1. Eutectic Process
| Step | Description |
| 1 | Place the incoming 6-inch wafer (supports 4 pcs of 6-inch wafer rings simultaneously) or waffle pack into the loading area; place the waffle pack for recycled materials into the unloading area (the waffle pack loading/unloading section can hold 8 pcs of 2-inch waffle packs in total). |
| 2 | After the camera of the material handling robot identifies the incoming materials, the robot picks up the materials by automatically changing the corresponding nozzles. |
| 3 | Left Station of Eutectic Stage: After picking up the materials, the material handling robot moves and places the materials onto the transfer platform beside the eutectic stage. |
| 4 | The eutectic stage moves to the right station. (The machine is equipped with two sets of eutectic stages and transfer stations, so the bonding head performs the picking and placing operation for the next batch of materials at this time.) |
| 5 | The camera of the eutectic robot identifies the materials on the transfer station, picks them up, and places them onto the eutectic stage for high-temperature eutectic bonding. |
| 6 | After completing the eutectic bonding, the eutectic stage returns to the left position, and the material handling robot unloads the finished products. |
| 7 | Repeat the above steps until the materials in the loading area are exhausted or the fixtures in the unloading area are full. The machine will automatically shut down, and operators replace the blue film and waffle packs manually. |
2. Adhesive Bonding Process
| Step | Description |
| 1 | Place the incoming 6-inch wafer (supports 4 pcs of 6-inch wafer rings simultaneously) or waffle pack into the loading area, and load the fixtures to be bonded into the unloading area. |
| 2 | After the camera of the material handling robot identifies the incoming materials, the robot picks up the materials by automatically changing the corresponding nozzles. |
| 3 | The eutectic robot identifies the materials in the fixtures and mounts the chips. |
| 4 | Mount all the materials in the fixtures in sequence. After completion, the machine stops and triggers an alarm to prompt operators to replace the materials. |
Main Component Overview
| No. | Component Name | Brief Introduction |
| 1 | Wafer Loading Structure | Accommodates up to four 6-inch wafers for 4 different material types; equipped with independent X & Y axes for precise wafer positioning. |
| 2 | Ejector Pin Assembly | Dual ejector pin groups support upward film piercing & downward film pulling, compatible with various chip sizes; composed of overall Z-axis and dedicated ejector pin Z-axis. |
| 3 | Manipulator & Bond Head Assembly | Two bond heads (material manipulator + eutectic manipulator). Each head has dual magnification vision systems with dedicated camera Z-axis; 12-station automatic nozzle library with ZR nozzle shaft. Linear Z-axis motor with pressure sensor realizes full closed-loop bonding pressure control. |
| 4 | Loading & Unloading Module (Independent Y-axis) | Configurable as feeding or receiving station. Supports waffle pack chip supply and collection of finished eutectic products. |
| 5 | Top-view Camera Unit | Consists of camera, lens and point light source. Used for nozzle calibration and backside inspection of chips during placement. |
| 6 | Dispensing Plate & Calibration Fixture | Calibration block tests pick-and-place precision of nozzles; dispensing plate supplies adhesive with scraper to control glue volume evenly. |
| 7 | Intermediate Transfer Platform | Fitted to each eutectic stage, with 8 independent vacuum positions for holding chips of various sizes and pre-positioning via vision. |
| 8 | Eutectic Stage Assembly | Dual eutectic stages with ceramic pulse heating. Nitrogen purging prevents oxidation of chips & substrates; built-in air cooling for rapid cooling. Closed-loop thermocouple temperature control with 10ms sampling, multi-segment temperature curve, adjustable level and overheat protection. |
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