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HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes.
The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.
Brand :
HYRNUSItem No. :
HY-WT9730Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic Wafer Grinding and Polishing Machine for Semiconductor Packaging
Product Introduction
HY-WT9730 fully automatic wafer grinding and polishing machine supports wafers up to 12-inch (Ø300mm). It conducts grinding and mirror polishing for all hard, brittle and ultra-hard materials to achieve wafer backside thinning.
Equipped with 3 grinding air-bearing spindles and 4 independent workpiece air-bearing spindles, the machine integrates rough grinding, fine grinding and mirror polishing processes. Its full robotic transfer system automatically completes wafer positioning, grinding, polishing, washing and drying. Only manual cassette loading is required to cut down manual operation and prevent wafer scratches and chipping. Fitted with ultra-precise Z-axis feed with a minimum increment of 0.1μm, it delivers superior flatness, low TTV and ultra-smooth mirror surface of Ra＜5nm. The heavy-duty anti-corrosion frame maintains consistent machining precision during long-term mass semiconductor production.
Product Application
This machine provides grinding and polishing for hard and brittle materials and electronic components. Compatible substrates up to 12 inches include Si, SiC, semiconductor compounds, epoxy resin, ceramics, sapphire, plus ultra-hard difficult-to-grind crystals LT and LN.
It realizes backside thinning for IC, discrete and LED silicon wafers, and is widely applied in semiconductor and optoelectronic precision manufacturing.
Machine Structure Diagram
Machine Operation Process
| Step | Operation Steps |
| 1 | Manually load the wafer cassette into the equipment |
| 2 | The robotic arm picks wafers from the cassette and transfers them to the positioning table for center alignment |
| 3 | The T1 arm absorbs the wafer and places it on the workpiece chuck table |
| 4 | Rough grinding process |
| 5 | Fine grinding process |
| 6 | Mirror polishing process |
| 7 | The T2 arm absorbs the machined wafer and sends it to the spin cleaning station for washing and drying |
| 8 | The wafer can be conveyed to the film mounter, or the robotic arm returns cleaned wafers to the cassette, and the whole process cycles repeatedly |
Specifications
| No. | Item | Parameter |
| 1 | Overall Dimension | 1690*3544*1951mm |
| 2 | Workpiece Size | Max. processing dimension: Ø300mm |
| 3 | Grinding Wheel Air Bearing Spindle | Quantity: 3 |
| Spindle power: 9.5KW | ||
| Spindle speed: 800~4000r/min | ||
| 4 | Workpiece Air Bearing Spindle | Quantity: 4 |
| Spindle speed: 50~300r/min | ||
| 5 | Grinding & Polishing Z-axis | Travel range: 120mm |
| Grinding feed rate: 0.0001~0.08mm/s | ||
| Minimum feed increment: 0.1μm | ||
| 6 | Clamping Method | Porous vacuum chuck |
| 7 | Post-processing TTV | 2.5μm |
| 8 | Wafer-to-wafer Thickness Variation after Processing | ±2.5μm |
| 9 | Post-processing Surface Roughness | Ra＜5nm |
Main Frame
| No. | Item | Details |
| 1 | Frame | Lower frame: 50100 square tube welded support (standard configuration) |
| Upper frame: 3060 aluminum profile | ||
| 2 | Cover Plate | Cold rolled steel plate with plastic spraying surface (standard configuration) |
| 3 | Structural Components | 45# steel with chrome-plated surface & anodized aluminum alloy |
| 4 | Power Supply | Three-phase 380V, 50Hz |
| 5 | Air Source | ≥0.5MPa, 400L/min |
Product Details
HY-WT9330 is equipped with one air-bearing grinding spindle and two air-bearing workpiece spindles. It can process various ultra-hard, brittle and hard-to-grind substrates up to 12 inches, enabling high-efficiency, damage-free and ultra-precise mirror grinding with outstanding thickness accuracy, suitable for the back thinning process of all types of chip wafers.
HY-WT9530 is fitted with 2 air-bearing spindles and 3 vacuum chuck tables for hard brittle substrates up to 8-inch. Operators only need to load cassettes manually, while the machine completes full automatic cycles including rough/fine grinding, cleaning and recovery. Post-grinding TTV≤1.5μm with excellent flatness and surface roughness, suitable for backside thinning of various semiconductor wafers.
HY-WT9230 is developed for ultra-hard brittle semiconductor materials up to 12 inches. Built with dual air-bearing spindles and a high-precision grinding Z-axis, it supports fully automatic mirror thinning with high efficiency and damage-free processing. Equipped with a porous vacuum chuck and ultra-fine feed control, the machine ensures superior flatness and thickness uniformity for semiconductor wafer thinning processes.
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