HY-TF110 Semiconductor Post Mold Equipment is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes.
Read More
leave a message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
