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HY-SP855 single-side copper polisher handles precision lapping and polishing for semiconductor hard brittle materials. It adopts PLC touch control and built-in disc conditioner, featuring variable frequency drive, closed-loop pressure control and plate water cooling. The conditioned plate flatness reaches 0.01mm, delivering stable, uniform processing for high-precision substrate mass production.
Brand :
HYRNUSItem No. :
HY-SP855Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSingle-Side Precision Copper Polishing Machine with PLC Touch Control and Disc Conditioner
Product Introduction
HY-SP855 series single-side precision copper polishing machine delivers high-precision single-side lapping and polishing for various semiconductor hard brittle materials. Integrated with a PLC touch screen control system and a built-in independent disc conditioner, it adopts variable frequency drive, closed-loop pressure control and constant-temperature grinding plate water cooling for stable operation and excellent uniformity across all stations. After conditioning, the grinding plate flatness reaches 0.01 mm with superior TTV and surface roughness performance, reliably supporting mass production of high-precision semiconductor substrates.
Product Advantages
1. This single-side precision lapping machine adopts advanced mechanical structure and multiple advanced control technologies, featuring high lapping efficiency and stable operation.
2. The whole machine is equipped with a PLC + touch screen control system. It enables simple parameter setting and operation with high system stability.
3. The main motor adopts variable frequency speed regulation to realize soft start and soft stop, reducing mechanical impact and workpiece damage.
4. Workpiece lapping pressure is applied via air cylinders, with closed-loop pressure control through an electro-pneumatic proportional valve to ensure ultra-high pressure accuracy and stability.
5. The upper pressure plate adopts active driving design, which guarantees consistent lapping results across all working stations while maintaining efficient processing speed.
6. The grinding plate is equipped with circulating water cooling, which maximizes slurry efficiency and minimizes plate deformation.
7. A built-in disc conditioner is integrated. The flatness of the grinding plate can reach 0.01 mm after conditioning.
Application Fields
It is mainly applied to single-side precision lapping and polishing of hard-brittle materials, including sapphire substrates, gallium nitride (GaN), optical glass wafers, silicon carbide (SiC) substrates, sapphire epitaxial wafers, silicon wafers, ceramic sheets, quartz crystals and other semiconductor substrates.
Product Composition
This machine adopts modular design, consisting of mechanical system, pneumatic and water supply system and electrical control system. Each independent subsystem ensures stable operation, precise pressure control and convenient maintenance.
Technical Parameter
| Parameter Name | Parameter Value |
| Model | HY-SP855 |
| Lapping Plate Specification (mm) | 855×255×12 |
| Ceramic Plate Diameter (mm) | 360 |
| Main Motor Power | 11 KW / 380 V |
| Pressure Plate Motor Power | 0.2 KW / 380 V (4 units) |
| Dressing Motor Power | 0.2 KW / 380 V |
| Maximum Polishing Plate Rotation Speed | 100 rpm (max) |
| Number of Equipment Stations | 4 stations |
| Operation Mode | Semi-automatic (manual loading/unloading) |
| Timing Range | 0-999 minutes |
| Maximum Set Pressure | 300 kgf (per head) |
| Minimum Set Pressure | 20 kgf (per head) |
| Air Source | 0.4-0.6 MPa (dry and oil-free) |
| Ultimate Vacuum Pressure (KPa) | -90 |
| Cooling Water Pressure | ≤ 2 kgf/cm² |
| Water Flow Rate | 15 L/min |
| Indoor Temperature | 15℃-25℃ |
| Relative Humidity | ≤ 80% |
| TTV (μm) | ≤ 5μm after processing 4-inch 7-piece ceramic plates |
| Surface Roughness Ra (nm) | 20 nm |
| Total Equipment Power (kW) | 12 kW |
| Total Equipment Weight (kg) | Approx. 3500 |
| Overall Dimensions (L×W×H) | 1200×2150×2250 mm |
| Main Plate Temperature Sensor Accuracy | ±5℃ |
| Throughput | ≥ 1320 pcs/day |
Key Equipment System
| System Category | Component | Specification / Brand |
| Mechanical Structure | Sheet Metal | National Standard 50×50×5 Square Tube + Industrial Grade Baking Paint Outer Frame |
| Parts | Stainless Steel 304 / AL6061 with Surface Anodizing Treatment | |
| Spindle | In-house Manufactured (Core Patent) | |
| Work Turntable | In-house Manufactured (Core Patent) | |
| Main Motor | Tung Yuan | |
| Reducer | Jiepai / Chengda | |
| Electrical Control System | PLC | Panasonic / Mitsubishi / Delta |
| Touch Screen | Touchwon / Weintek / Advantech | |
| Power Protection | Leakage Circuit Breaker (Mean Well / Schneider) | |
| DC Power Supply | Switching Power Supply (Mean Well / Schneider) | |
| Pneumatic System | Air Cylinder | SMC / CKD / FESTO |
| Pressure Control | SMC / CKD / FESTO | |
| Pressure Regulation | SMC / CKD / FESTO | |
| Pressure Indication | SMC / CKD / FESTO | |
| Solenoid Valve | SMC / CKD / FESTO |
Product Details
HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.
The HY-SP910 is equipped with PLC & touchscreen control system for simple setup, easy operation and stable performance. It performs ultra-precise single-sided polishing on thin components, supporting semiconductor substrates (sapphire, SiC, silicon & epitaxial wafers) as well as optical glass wafers, quartz crystals, ceramic wafers, stainless steel workpieces and fiber-optic connectors.
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