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The HY-SP910 is equipped with PLC & touchscreen control system for simple setup, easy operation and stable performance. It performs ultra-precise single-sided polishing on thin components, supporting semiconductor substrates (sapphire, SiC, silicon & epitaxial wafers) as well as optical glass wafers, quartz crystals, ceramic wafers, stainless steel workpieces and fiber-optic connectors.
Brand :
HYRNUSItem No. :
HY-SP910Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSingle-Side Wafer CMP Polishing Machine for Semiconductor Substrates
Product Introduction
The HY-SP910 Wafer CMP Single-Side Polisher is built with advanced mechanical architecture and multiple mature control algorithms, delivering excellent polishing throughput and stable long-term operational performance. It features an integrated PLC & touchscreen control system, enabling users to finish parameter configuration and daily operation effortlessly via an intuitive operation interface.
This unit adopts air cylinder loading for polishing pressure, paired with electro-pneumatic proportional valves to achieve full closed-loop pressure control for ultra-high pressing accuracy and uniform pressure output across the entire polishing cycle. Its actively driven upper carrier ensures consistent polishing results at all stations, while circulating cooling water on both the polishing platen and upper carrier maximizes slurry efficiency and suppresses thermal deformation of the platen surface.
Product Advantages
1. High Efficiency & Stable Operation: This is a single-sided precision polishing machine, adopting an advanced mechanical structure and multiple sophisticated control methods, featuring high polishing efficiency and stable operation.
2. User-Friendly Control System: The whole machine adopts a PLC + touchscreen control system, which enables simple and convenient equipment parameter setting and operation, with high system operation stability.
3. Soft Start/Stop Protection: The main motor is controlled by variable frequency speed regulation, realizing soft start and soft stop of the main machine, reducing equipment operation impact and minimizing workpiece damage.
4. High-Precision Pressure Control: The workpiece polishing pressure adopts cylinder pressurization, and closed-loop pressure control is realized through an electric proportional valve, ensuring extremely high pressure application accuracy and stability.
5. Active Drive for Uniform Polishing: The upper pressure plate adopts an active drive mode, ensuring the uniformity of polishing processing at each station while guaranteeing the product polishing rate.
6. Cooling System for Process Stability: Both the polishing platen and upper pressure plate are equipped with cooling water functions, maximizing the efficiency of the polishing slurry while reducing deformation of the polishing platen surface.
Application Fields
This machine performs single-sided ultra-precision polishing for thin precision workpieces. Its core processing targets are semiconductor substrates including sapphire substrates, silicon carbide substrates, silicon wafers and sapphire epitaxial wafers. It is also compatible with optical and precision metal parts such as optical glass wafers, ceramic wafers, quartz crystals, stainless steel workpieces and fiber-optic connectors.
Product Composition
Technical Parameter
|
Parameter Name |
Parameter Value |
| Model | HY-SP910 |
| Polishing Head Swing Range | ±5 mm |
| Polishing Head Rotation Speed | 0~70 rpm |
| Polishing Disc Specification | 910 mm |
| Polishing Disc Rotation Speed | 0~80 rpm |
| Polishing Liquid Flow Rate | 15 L/min |
| Workpiece Disc Size | 360 mm |
| Single Station Pressure | 20~300 KG |
| Workpiece Disc Rotation Speed | 0~70 rpm |
| Main Motor Power/Voltage | 11 KW / 380 V |
| Processing Size | 2~8 inches |
| Number of Equipment Stations | 4 |
| Polishing Machine Type | Vertical Turntable Polishing |
| Operation Mode | Semi-automatic (Manual Loading/Unloading) |
| Surface Roughness Ra(nm) | 5 nm |
| Total Equipment Power | 12 KW |
| Total Equipment Weight | Approx. 3000 KG |
| Overall Dimensions (LxWxH) | 1200 x 1650 x 2250 mm |
Key Specifications
| Category | Item | Specification |
| Mechanical Structure | Sheet Metal | Standard 50 x 50 x 5 Square Tube + Industrial Grade Baking Varnish Frame |
| Components | Stainless Steel 304 / AL 6061 with Surface Oxidation Treatment | |
| Worktable | Custom-made (Core Patent Owned) | |
| Main Motor | TECO | |
| Reducer | Jiess / Chanta | |
| Electrical Control System | PLC | Delta / Panasonic / Mitsubishi |
| Touch Screen | TouchThink / Weintek / Advantech | |
| Power Protection | Earth Leakage Circuit Breaker (Mean Well / Schneider) | |
| DC Power Supply | Switching Power Supply (Mean Well / Schneider) | |
| Pneumatic System | Air Cylinder | SMC / CKD / FESTO |
| Pressure Control | SMC / CKD / FESTO | |
| Pressure Regulation | SMC / CKD / FESTO | |
| Pressure Indication | SMC / CKD / FESTO | |
| Solenoid Valve | SMC / CKD / FESTO |
Product Details
HY-WT9730 supports wafers up to 12-inch. Equipped with 3 grinding air-bearing spindles and 4 workpiece air-bearing spindles, it integrates rough grinding, fine grinding and polishing processes. The full robotic workflow automatically completes wafer transfer, processing, cleaning and unloading; only manual cassette feeding is needed. Ultra-precise Z-axis feed delivers superior wafer flatness and damage-free mirror polishing, while its sturdy frame guarantees stable mass production.
HY-SP855 single-side copper polisher handles precision lapping and polishing for semiconductor hard brittle materials. It adopts PLC touch control and built-in disc conditioner, featuring variable frequency drive, closed-loop pressure control and plate water cooling. The conditioned plate flatness reaches 0.01mm, delivering stable, uniform processing for high-precision substrate mass production.
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