3D stacking die bonding machine

HY-DB300 Fully Automatic Dispensing and Die Bonding Machine is a fully automatic dispensing and die bonding machine designed for high-precision multi-chip and chip-to-wafer assembly. It supports wafers up to 8 inches, chips from 0.2 × 0.2 mm to 15 × 15 mm, wafer mapping, dual-vision positioning and 3D stacking up to 5 mm. The machine achieves ±3 μm placement accuracy and a pick-and-place capacity of up to 1,200 UPH.