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HY-DB300 Fully Automatic Dispensing and Die Bonding Machine is a fully automatic dispensing and die bonding machine designed for high-precision multi-chip and chip-to-wafer assembly. It supports wafers up to 8 inches, chips from 0.2 × 0.2 mm to 15 × 15 mm, wafer mapping, dual-vision positioning and 3D stacking up to 5 mm. The machine achieves ±3 μm placement accuracy and a pick-and-place capacity of up to 1,200 UPH.
Brand :
HYRNUSItem No. :
HY-DB300Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaEpoxy Dispensing and Chip-to-Wafer Die Bonding Machine
Product Introduction
HY-DB300 Fully Automatic Dispensing and Die Bonding Machine integrates precision dispensing, chip placement, and die bonding in one automated platform for advanced semiconductor packaging. Designed for multi-chip and chip-to-wafer applications, it supports wafers up to 8 inches and chip sizes from 0.2 × 0.2 mm to 15 × 15 mm. The system combines wafer mapping, dual-magnification vision, real-time center correction, and multiple PR recognition methods to achieve positioning accuracy of ±3 μm at 3σ. It also supports flexible multi-reference bonding, contact height measurement with ±1 μm accuracy, and 3D chip stacking up to 5 mm. Bonding force is adjustable from 15 to 500 g with ±2 g control accuracy. With a pick-and-place capacity of up to 1,200 UPH and optional Class 100 cleanroom compatibility, the HY-DB300 is suitable for hybrid circuits, MCMs, optoelectronic devices, and other high-precision electronic assemblies.
Equipment Performance
| No. | Feature |
| 1 | Fast and precise horizontal rotary indexing head |
| 2 | Wafer mapping function |
| 3 | Dual-magnification dual-vision system (high and low magnification) |
| 4 | Supports flexible multi-reference die bonding |
| 5 | Real-time vision center correction |
| 6 | Class 100 cleanroom compatibility (optional) |
| 7 | 3D stacking capability, up to 5 mm |
| 8 | Integrated in-line contact height measurement, supports dispensing needle height measurement |
| 9 | Flexible process flow, supports free combination of process steps, allows individual disabling |
| 10 | Multiple PR recognition methods (template matching, edge positioning, reference pattern positioning, geometric center positioning, etc.) |
Application
*Multi-chip modules
*Wafer-level assembly
*3D chip stacking
*Hybrid circuits
*High-precision optoelectronics
Technical Specifications
| No. | Parameter | Specification |
| 1. | Force Control Accuracy | ±2 g |
| 2. | Position Accuracy | ±3 μm @ 3σ |
| 3. | Angle Accuracy | ±0.15° @ 3σ |
| 4. | Height Measurement Accuracy | ±1 μm |
| 5. | Wafer Size | 8 inch (compatible with 4 inch and 6 inch) |
| 6. | Chip Size | Min. 0.2mm × 0.2mm, Max. 15mm × 15mm |
| 7. | Wafer Ring / Magnetic Plate Size | 2 inch |
| 8. | Wafer Ring / Magnetic Plate Quantity | 20 units (expandable to 30 units) |
| 9. | Travel Range | X-axis 360mm, Y-axis 657mm, Z-axis 300mm |
| 10. | Input Voltage | 220V ± 10% @ 50/60Hz |
| 11. | Rated Power | 1 kW |
| 12. | Footprint (W×D×H) | 1300mm × 1570mm × 1900mm |
| 13. | Dispensing Valve | Wuwei Precision Pneumatic Control Valve SUPER-ICMIII |
| 14. | Number of Nozzles | 12 (including height measurement) |
| 15. | Height Measurement Method | Contact type |
| 16. | Adhesive Type | Epoxy |
| 17. | Syringe Size | 3cc, 5cc, 10cc |
| 18. | Minimum Dispensing Needle Diameter | Ø0.25 mm |
| 19. | Bonding Force | 15~500 g |
| 20. | UPH | 1200 (pick & place only) |
| 21. | Operating System | Windows |
| 22. | Compressed Air Requirement | 0.4~0.6 MPa |
| 23. | Vacuum Line Pressure | ≤ -85 kPa |
| 24. | Net Weight | 1.35 T |
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