HY-GD3000 serves diverse adhesive chip packaging with programmable mounting. It supports in-line loading, 300×200mm fixtures, auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins, and processes up to 12-inch wafers. It features syringe & multi-glue tray dispensing, full closed-loop Z-axis force control (min 10±1g) and flip chip mounting. Dual vision enables visualized, stable & precise microchip packaging.
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