What Are You Looking For?
HY-GD3000 serves diverse adhesive chip packaging with programmable mounting. It supports in-line loading, 300×200mm fixtures, auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins, and processes up to 12-inch wafers. It features syringe & multi-glue tray dispensing, full closed-loop Z-axis force control (min 10±1g) and flip chip mounting. Dual vision enables visualized, stable & precise microchip packaging.
Brand :
HYRNUSItem No. :
HY-GD3000Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAutomatic Die Bonder with 12 Nozzle Magazine for Flip Chip Adhesive Packaging
Product Introduction
HY-GD3000 Automatic Die Bonder is engineered for all types of adhesive chip packaging with fully programmable mounting sequences to fit customized production workflows. It supports automatic in-line loading and unloading, accommodates maximum 300×200mm fixtures, and comes with auto-switchable 12 dispensing tips, 12 pick-up nozzles and 5 ejector pins, capable of handling wafers up to 12 inches.
This machine provides dual dispensing solutions including syringe dispensing and multi-glue tray feeding, paired with full closed-loop Z-axis force control that delivers an ultra-minimum bonding force of 10±1g to protect tiny components. Flip chip 180-degree rotation mounting function is integrated to meet advanced packaging demands.
Equipped with multi-channel dual vision inspection system, the whole mounting procedure is fully visualized, delivering consistent, stable and ultra-precise processing performance for mass microchip semiconductor production.
Component List
| No. | English Name |
| 1 | Assembly Line |
| 2 | Dipping Nozzle Storage |
| 3 | Glue Tray |
| 4 | Dispensing Manipulator & CCD1 |
| 5 | Wafer Recognition CCD2 |
| 6 | Die Mount Manipulator & CCD3 |
| 7 | Nozzle Library |
| 8 | Die Backside Recognition CCD4 |
| 9 | Waffle Pack Loading Area |
| 10 | Die Flip System |
| 11 | Blue Tape Loading & Unloading Manipulator |
| 12 | Blue Tape Cassette System |
| 13 | Ejector Pin System |
| 14 | Wafer Holding System |
Product Features
1. Compatible with various adhesive chip packaging processes, programmable mounting procedures
2. Supports in-line loading & unloading, max fixture size: 300×200 mm
3. Auto-switchable 12 dispensing tips, 12 nozzles and 5 ejector pins
4. Handles wafers up to 12-inch
5. Dual dispensing modes: syringe dispensing and multi-glue tray
6. Full closed-loop Z-axis force control, minimum bonding force: 10±1 g
7. Flip chip mounting supported
8. Visualized whole mounting process
Main Functional Modules
| Component Name | Description |
| Conveyor & Bonding Tip Magazine | Adjustable conveyor width up to 200mm, mechanical clamps at dispensing & bonding stations; rotary nozzle magazine holds max 12 nozzles |
| Dipping Tip Storage & Glue Trays | Holds 12 dipping tips for various dot sizes; dual glue trays for two adhesives; auto cleaning & height calibration for dispensing needles |
| Dispensing Manipulator & CCD1 | XYZ manipulator with CCD for high-precision dispensing; supports dipping & syringe dispensing; contact & non-contact height measurement |
| Bonding Manipulator & CCD Positioning System | Auto-focus CCD2 for blue tape die, CCD3 for substrate & die alignment; linear motor XYZR manipulator for stable motion; full closed-loop Z force control with position/torque loop switch |
| Flip Chip Module, Die Tray Loader & Top-view CCD4 | CCD4 backside recognition for die positioning; optional 180掳 flip module, 4pcs 2" wafer trays without flip function; pressure sensor calibrates nozzle force; calibration plate verifies bonding accuracy |
| Blue Tape Loading & Unloading System | Gripper manipulator transfers blue tape between magazine and work stage; magazine lifting unit auto loads/unloads multi-layer blue tapes |
| Ejector Pin System | Supports upward ejecting & downward peeling; ejector pin magazine with 5 sets for multi-size die peeling |
| Wafer Ring Worktable | XY module delivers precise wafer movement; holds 1pc 12" or 4pcs 6" blue tapes for higher throughput |
| Machine Frame | Cast iron & cast aluminum frame with stiffness & modal analysis; stress-relieved castings ensure long-term stable operation |
| Magazine Loading & Unloading System (Optional) | Optional magazine loading/unloading: fixtures auto in/out trays for inline dispensing & bonding; fully enclosed design prevents material contamination |
Product Details
HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications.
HY-ED010 Die Bonding Machine is a Die bonding machine developed for Automotive LED and Optoelectronic Semiconductor Packaging applications.
HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
HY-ED003 Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications.
HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications.
HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.
HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.
leave a message
Scan To Wechat :
Scan To WhatsApp :
