HY-TF200D is dedicated post-mold punching equipment for semiconductor packaging lines, integrating lead trimming, pin forming and component singulation in one automatic cycle. It supports SOT, EMC, TO, DIP and optocoupler packaging with an adjustable punching speed of 60–100 SPM.
This machine is standard fitted with Mitsubishi/Yonghong PLC, servo-driven power system and complete safety protection. CCD visual inspection and MES system networking can be optionally equipped to meet intelligent digital packaging workshop demands.
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