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HY-TF200D is dedicated post-mold punching equipment for semiconductor packaging lines, integrating lead trimming, pin forming and component singulation in one automatic cycle. It supports SOT, EMC, TO, DIP and optocoupler packaging with an adjustable punching speed of 60–100 SPM.
This machine is standard fitted with Mitsubishi/Yonghong PLC, servo-driven power system and complete safety protection. CCD visual inspection and MES system networking can be optionally equipped to meet intelligent digital packaging workshop demands.
Brand :
HYRNUSItem No. :
HY-TF200DOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic Lead Trimming, Forming and Singulation Equipment with Down Drive Mechanism
Product Introduction
HY-TF200D Fully Automatic Lead Trimming, Forming and Singulation Machine adopts a down drive punching system, specially customized for semiconductor post-mold packaging processes. After electronic components complete plastic encapsulation, all parts are connected on shared lead frames, and this all-in-one equipment automatically finishes high-speed punching, lead shaping and component singulation in continuous cycles.
It eliminates the need for separate single-function machines and manual trimming work, significantly improving overall production throughput and saving factory workshop layout space. This punching machine is widely installed in professional IC packaging factories, discrete semiconductor component workshops and large-scale optocoupler mass production lines.
Product Application
This down drive equipment handles post-mold lead trimming, forming and singulation for SOT, EMC, TO, DIP and optocoupler semiconductor parts at 60–100 SPM. It adopts cam feeding, dual spring clip non-stop loading and tube/bulk tray collection, equipped with Mitsubishi/Yonghong servo PLC and full safety protection. Optional CCD visual inspection and MES networking make it perfect for mass production in IC packaging plants, discrete component and optocoupler workshops.
Product Features
1. All-in-one down-drive system for post-mold lead trimming, forming and singulation
2. Compatible with SOT, EMC, TO, DIP & optocouplers, punching speed: 60–100 SPM
3. Non-stop cyclic loading with dual spring clips, tube / bulk tray dual collection modes
4. Servo motor drive, Mitsubishi/Yonghong PLC touch control, cylinder slide mold structure
5. Full safety protection (light curtain, door sensor, E-stop); optional CCD inspection & MES networking
Technical Specifications
| Item | Specification |
| Equipment Name | Single Bottom-Mounted Power Automatic Punching System |
| Application | Punching, forming and singulation of leads and pins after component plastic encapsulation |
| Compatible Package Types | SOT, EMC, TO, DIP, Photoelectric Optocoupler |
| Punching Speed (SPM) | 60–100 strokes per minute |
| Control System | Mitsubishi / Yonghong PLC + Touch Screen + Operation Buttons |
| Power System | Servo Motor + Reducer |
| Mold Opening & Closing Mechanism | Large Cylinder + Left & Right Slide Lock Mechanism |
| Feeding Mechanism | Cam Feeding |
| Loading Mechanism | Dual Independent Spring Clips, Non-stop Cyclic Loading |
| Receiving Mechanism | Tube Collection or Bulk Tray Collection |
| Safety Design | Light Curtain, Door Open Sensor, Emergency Stop Button |
| Optional Accessories | 1. CCD Visual Inspection Device |
| 2. MES System Networking Function |
Product Details
HY-TF200L adopts dual lower flywheel stamping system for semiconductor post-molding lead frame trimming, forming & singulation, compatible with SOT, TO, SOP and DIP packages. It runs 80–120 strokes per minute with PLC control and full safety interlocks, supporting optional CCD visual inspection and MES system networking. Comes with full series precision mold spare parts, it meets mass IC packaging production requirements.
HY-TF200U is specially designed for post-molding lead trimming, forming and separation of semiconductor packaging components. Compatible with SOT, TO, SOP, DIP, IPM, photovoltaic modules & optocouplers. Equipped with full servo drive system, dual magazine non-stop feeding, safety light curtain protection, optional CCD visual inspection and MES networking function, punching speed up to 30–60 SPM, stable high-efficiency mass production solution for IC packaging industry.
HY-TF100 is designed for post-mold semiconductor IC lead trimming, pin forming and singulation. Compatible with mainstream miniature packages including SOT, SOD, TSOT and PDFN, it delivers a punching speed of 120–200 SPM. Featuring servo feeding and dual non-stop spring clamps, this equipment significantly boosts throughput of semiconductor packaging lines. It is equipped with complete safety protection as standard, while optional CCD visual inspection and MES networking are available to support smart factory digital management.
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HY-DS30K is an high-speed integrated dicing saw developed for post-mold singulation of semiconductor molded substrates. It supports an integrated processing flow including substrate cutting, cleaning, vision inspection, sorting and tray binning, which greatly improves the production efficiency of standard semiconductor backend packaging processes.
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