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Diamond Dicing Saw

1 results found for "Diamond Dicing Saw"
  • Wafer Saw
    Single-Spindle Semi-automatic 12-inch Tape Saw With NCS Non-contact Height Measurement for Package Singulation
    HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
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Contact us:allen@hyrnus.com