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HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
Brand :
HYRNUSItem No. :
HY-PD1201Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSingle-Spindle Semi-automatic 12-inch Tape Saw With NCS Non-contact Height Measurement for Package Singulation
Product Introduction
HY-PD1201 Single-Spindle Semi-automatic 12-inch Tape Saw serves as a versatile tape dicing saw capable of processing workpieces up to 12 inches in size. Equipped with full closed-loop grating scale control on the Y-axis, the machine achieves outstanding positioning precision for long-term consistent processing. Its standard configurations cover NCS non-contact height detection, a vision system combining coaxial and ring dual light sources, plus a durable imported high-speed spindle. Boasting a compact body that saves factory space, low operating noise and intuitive touchscreen operation, this equipment delivers stable high-precision cutting performance for various hard brittle materials. It is integrated with a complete set of practical processing functions such as multi-piece batch cutting, automatic image identification alignment and breakpoint resume cutting.
Product Features
1. Compact structure with small footprint and low operating noise.
2. Integrated industrial all-in-one machine equipped with touchscreen for easy operation.
3. Full closed-loop control with linear grating scale on Y-axis to deliver high positioning accuracy.
4. Equipped with both ring light source and coaxial light source for clear observation of workpieces made from diverse materials.
5. Complete range of safety protection functions.
6. Imported spindle adopted to improve cutting quality.
7. Built-in NCS non-contact on-line height measurement function to boost automation level.
8. Optimized motion control algorithm brings a 10% higher efficiency than conventional machines for multi-sheet cutting tasks.
Product Application
This equipment supports precision processing for various hard brittle materials, including silicon wafers, plastic encapsulated components (DFN, QFN, BGA, etc.), PCBs, ceramic substrates (alumina, zirconia, etc.), oxide ceramics for thermistors, piezoresistors and photoresistors, glass, quartz, lithium niobate, and lithium tantalate.
It is widely adopted for precision cutting across multiple industries, such as electronic components, integrated circuits (IC), LEDs, solar cells, optical devices, fiber optic components and electronic ceramics.
Technical Specifications
| No. | Item | Parameter | Remarks |
| 1 | Processing Size | Φ310 / 340×340 mm Chuck | Max 12-inch workpiece |
| 2 | Imported Spindle | Rotation Speed: 10000–60000 rpm | Single spindle |
| Power: 2.4 KW | |||
| 3 | X-axis | Cutting Travel: Max 350 mm | — |
| Drive: Servo motor | |||
| Resolution: 0.001 mm | |||
| Cutting Speed: 0.1–1000 mm/s | |||
| 4 | Y-axis | Cutting Travel: Max 330 mm | — |
| Drive: Servo motor + full closed-loop linear grating scale | |||
| Repeat Positioning Accuracy: 0.005 mm | |||
| Resolution: 0.0005 mm | |||
| Cumulative Error: 0.005 mm / 310 mm | |||
| Cutting Speed: 0.1–300 mm/s | |||
| 5 | Z-axis | Effective Travel / Blade Hub Size: Max 14.7 mm / Φ58 mm | Max cutting depth ≤4 mm |
| Drive: Servo motor | |||
| Resolution: 0.001 mm | |||
| Repeat Positioning Accuracy: 0.001 mm | |||
| Blade Hub Size: Φ47.4 mm ~ Φ54 mm | |||
| Max Blade Diameter: Φ60 mm | |||
| Max Speed: 90 mm/s | |||
| 6 | θ-axis | Rotation Range: Max 380° | — |
| Drive: DD direct-drive motor | |||
| Repeat Positioning Accuracy: 3 arcsec | |||
| Resolution: 0.0002° | |||
| 7 | Alignment System | Light Source: Coaxial + ring dual light | — |
| Magnification: Low 0.75X / High 1.5X | |||
| Minimum observable feature: 0.0005 mm | |||
| 8 | Machine Weight | 1000 kg ±5% | — |
| 9 | Overall Dimension | 980 × 1100 × 1750 mm (L×W×H) | — |
| 10 | Total Power Consumption | 4 KW | — |
Basic Configuration
| No. | Item Name | Brand (Origin) | Qty & Unit |
| 1 | X-axis Linear Guide | THK (Japan) | 1 pair |
| 2 | Y-axis Linear Guide | THK (Japan) | 1 pair |
| 3 | Z-axis Linear Guide | THK (Japan) | 1 pair |
| 4 | X-axis Ball Screw | THK (Japan) | 1 piece |
| 5 | Y-axis Ball Screw | THK (Japan) | 1 piece |
| 6 | Z-axis Ball Screw | THK (Japan) | 1 piece |
| 7 | DD Direct Drive Motor | THK (Japan) | 1 set |
| 8 | X-axis Servo Motor | Panasonic (Japan) | 1 set |
| 9 | Y-axis Servo Motor | Panasonic (Japan) | 1 set |
| 10 | Z-axis Servo Motor | Panasonic (Japan) | 1 set |
| 11 | Linear Encoder | Renishaw (UK) | 1 set |
| 12 | Pneumatic Components | AIRTAC (Taiwan, China) | 1 set |
| 13 | High Precision Digital Pressure Switch | AIRTAC (Taiwan, China) | 1 set |
| 14 | Spindle | RPS (South Korea) | 1 set |
Functional Configurations
1. Height measurement loop detection & alarm function
2. Resume cutting from breakpoints
3. Pre-cutting function
4. Auto focusing function
5. Non-contact height sensing (NCS)
6. Proportional valve control for cutting cooling water flow
7. Supports cutting of rectangular and circular workpieces
8. Auto cutting mode & semi-auto cutting mode optional
9. Unidirectional cutting mode & bidirectional cutting mode optional
10. Pause inspection available at any time during operation
11. Chinese operation interface; capable of saving multiple processing programs
12. Full-process real-time micro error compensation
13. Alarm & protection against insufficient air pressure / water pressure
14. Programmable processing for complex workpieces
15. Automatic image recognition
16. Multi-sheet batch cutting
Operating Environment
| Item | Requirements |
| Ambient Temperature | The machine shall be installed at a constant temperature of 25°C, preferably in a constant-temperature dust-free clean room. |
| Power Supply | Single-phase 380V, total power 4KW |
| Compressed Air | Adopt compressed air with filtration precision of 0.01μm and filtration efficiency ≥99.5%, dehumidified by refrigerated air dryer. |
| Air pressure: 0.6 MPa–0.8 MPa | |
| Air consumption for spindle: 100 L/min | |
| Total air consumption of the whole machine: 200 L/min | |
| Cutting Water | Water temperature controlled at room temperature ±2°C, water pressure 0.2–0.4 MPa. |
| Tap water is acceptable; wastewater can be directly discharged after treatment. | |
| Water consumption: 3 L/min | |
| Cooling Water (Spindle Cooling) | Circulating pure water supply by water chiller unit. |
| Temperature controlled at room temperature ±2°C, pressure 0.2–0.4 MPa | |
| Surroundings | Do not install the equipment beside blowers, air vents, or machines generating high temperature and oil mist. |
Product Details
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
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