HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
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