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HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
Brand :
HYRNUSItem No. :
HY-WD801Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China8-inch Single Spindle Semi-automatic Wafer Dicing Saw with Compact Footprint
Product Introduction
HY-WD801 8-inch Single Spindle Semi-automatic Wafer Dicing Saw provides a maximum workpiece size of Φ210mm for 6–8 inch frame workpieces, with 220mm X/Y cutting travel. It shares the same motion accuracy, spindle performance, blade protection functions and control system as the HY-WD1201, featuring 0.1–1000mm/s feed speed, 10000–60000rpm spindle speed and compatibility with Φ58mm max blades.
With identical high-precision mechanical architecture and stable cutting performance, the compact machine measures 1020*890*1750mm and weighs about 800KG with smaller footprint. Ideal for medium and small-batch precision dicing of 6–8 inch wafers, optical communication components and miniature ceramic substrates.
Product Features
1. Compact structure, small footprint and low noise.
2. Integrated industrial machine with touch screen for easy operation.
3. Closed-loop control with linear grating scale on Y-axis delivers high positioning accuracy.
4. Equipped with ring light and coaxial light to observe workpieces of various materials.
5. Complete safety protection functions.
6. Imported spindle improves processing quality.
7. Built-in NCS online height measurement function for higher automation.
8. Online blade sharpening function ensures consistent cutting quality.
9. Real-time broken blade detection (BBD) guarantees stable cutting performance.
Product Application
This equipment is applicable for processing silicon wafers, plastic packaged components (QFN, BGA, etc.), PCBs, ceramic substrates (alumina, zirconia, etc.), oxide ceramics (thermistors, varistors, photoresistors), glass, quartz, lithium niobate, lithium tantalate, and magnetic materials.
It is widely used for precision dicing across industries including electronic components, integrated circuits (IC), LEDs, solar cells, optical devices, fiber-optic parts and electronic ceramics.
Reliable and convenient operating system
1. A 15-inch touch operation panel displays comprehensive machine operating status data, delivering an easier and smoother operating experience.
2. All fluid parameters are software-controlled and stored in program groups, cutting down debugging time during product changeover.
3. Custom optimized software for multi-workpiece cutting paths delivers 10% higher processing speed than traditional cutting routines.
4. Self-developed low-level motion control and image processing algorithms enhance the overall system’s reliability and stability.
5. It supports SEMI industry-standard communication protocols for easy integration with factory automation systems.
Technical Specifications
| No. | Item | Specification Parameters | Remarks |
| 1 | Processing Size | Φ210 mm / Φ150 mm | 8-inch / 6-inch |
| 2 | Imported Spindle | Rotation Speed: 10000–60000 rpm | |
| Power: 1.8 kW | |||
| 3 | X-Axis | Dicing Travel: Max. 220 mm | |
| Drive Type: Servo Motor | |||
| Resolution: 0.001 mm | |||
| Dicing Speed: 0.1–1000 mm/s | |||
| 4 | Y-Axis | Dicing Travel: Max. 220 mm | |
| Drive Type: Servo Motor + Full Closed-Loop Grating Ruler | |||
| Repeat Positioning Accuracy: 0.002 mm / 5 mm | |||
| Resolution: 0.0005 mm | |||
| Cumulative Error: 0.005 mm / 220 mm | |||
| Dicing Speed: 0.1–300 mm/s | |||
| 5 | Z-Axis | Effective Travel / Chuck Size: Max. 30 mm / Φ58 mm | Max. cutting depth ≤ 4 mm |
| Drive Type: Servo Motor | |||
| Resolution: 0.001 mm | |||
| Repeat Positioning Accuracy: 0.001 mm | |||
| Chuck Size: Φ47.4 mm ~ Φ54 mm | |||
| Blade Outer Diameter: Max. Φ58 mm | |||
| Max. Travel Speed: 90 mm/s | |||
| 6 | θ Axis | Rotation Range: Max. 380° | |
| Drive Type: DD Direct Drive Motor | |||
| Repeat Positioning Accuracy: 3 arcseconds | |||
| Resolution: 0.0002° | |||
| 7 | Alignment System | Illumination: Coaxial + Ring Light | |
| Magnification: Low 0.75X / High 1.5X | |||
| Visible Image Resolution: 0.0005 mm | |||
| 8 | Equipment Weight | 500 kg ±5% | |
| 9 | Overall Dimension | 1030 mm × 900 mm × 1750 mm | |
| 10 | Total Equipment Power | 4 kW |
Operating Environment
| Item | Specifications |
| Ambient Temperature | The machine shall be installed in an environment of 25°C, preferably a constant-temperature dust-free cleanroom. |
| Power Supply | Single-phase AC220V, 4kW |
| Compressed Air | Adopt compressed air with filtration efficiency ≥99.5% for 0.01μm particles. Equipped with refrigerated air dryer for dehumidification. |
| Air pressure: 0.6–0.8MPa | |
| Air consumption of spindle: 80L/min | |
| Total air consumption of the whole machine: 190L/min | |
| Dicing Water | Dicing water temperature shall be controlled at room temperature ±2°C, pressure 0.2–0.4MPa. Tap water is acceptable, and wastewater can be directly discharged after treatment. |
| Water consumption: 2L/min | |
| Cooling Water (Spindle Cooling) | Circulating pure water supplied by water purifier. Water temperature controlled at room temperature ±2°C, pressure 0.2–0.4MPa. |
| Surroundings | Do not install the equipment beside blowers, air vents, or equipment generating high temperature and oil mist. |
Product Details
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
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