HY-DD560P is dedicated production equipment for COB and COC processes. It mainly performs epoxy dispensing and die bonding between substrates (PCB or other carrier materials to be processed) and chips. Integrated with automatic loading/unloading, parallel dispensing & die picking, and multi-CCD vision positioning compensation full-automatic workflow, it enables stable high-precision die attaching and bonding, suitable for mass packaging production of optoelectronic and communication chips.
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