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Full Automatic Dicing Saw

1 results found for "Full Automatic Dicing Saw"
  • Semiconductor Dicing Machine
    12-inch Dual Spindle Full-automatic Wafer Dicing Saw for Mass Production
    HY-WD1202 adopts imported RPS spindles, NSK precision transmission parts and Renishaw encoders for Y-axis closed-loop control with high positioning accuracy. It supports NCS height measurement, BBD blade detection, auto image recognition and on-wheel dressing, suitable for silicon, SiC/GaN wafers, ceramics, PCBs and optical glass. Applied to precision dicing for IC, power device and LED industries, the touchscreen machine has full pressure and temperature alarm protection. It offers multiple cutting modes for regular and complex workpieces, fitting for mass production in constant-temperature clean rooms.
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