12-inch Dual Spindle Full-automatic Wafer Dicing Saw for Mass Production

Product Introduction

This 12/8-inch Dual Spindle Full-automatic Wafer Dicing Saw is equipped with imported high-speed RPS spindles, a full set of precision NSK transmission components and Renishaw linear encoders for Y-axis full closed-loop control, delivering outstanding positioning accuracy. Integrated with comprehensive intelligent functions including NCS non-contact height measurement, BBD blade breakage detection, automatic image recognition and on-wheel blade dressing, the machine processes silicon wafers, SiC/GaN compound semiconductors, ceramic substrates, PCBs, optical glass and various other materials.

It is widely used for precision dicing in IC packaging, power devices, LED and electronic ceramic industries. Featuring an integrated touchscreen for easy operation, the system is equipped with complete alarm protection for pressure, flow and temperature. It supports automatic / semi-automatic, unidirectional / bidirectional cutting modes, and can process rectangular, circular and complex programmed workpieces, ideal for mass production in constant-temperature clean rooms.

Product Features

Product Application

This machine is capable of dicing silicon wafers, QFN/BGA plastic packages, PCBs, alumina & zirconia ceramic substrates, oxide ceramics for thermistors, varistors and photoresistors, glass, quartz, lithium niobate, lithium tantalate and magnetic materials, delivering precision cutting solutions for electronic components, ICs, LEDs, solar cells, optical components, fiber optic parts and electronic ceramics industries.

Technical Specifications

 

No.	Item	Parameter	Remarks
1	Processing Size	Φ310 / Φ210mm	12 inch / 8 inch
2	Imported Spindle	Rotation Speed: 10000–60000 rpm	Dual Spindles
		Power: 1.8kW
3	X-axis	Dicing Travel: Max 310mm	-
		Drive: Servo Motor
		Resolution: 0.0001mm
		Dicing Speed: 0.1–1000mm/s
4	Y-axis	Dicing Travel: Max 310mm	-
		Drive: Servo Motor + Linear Encoder Full Closed-loop
		Repeat Positioning Accuracy: 0.003/5mm
		Resolution: 0.0005mm
		Cumulative Error: 0.003/310mm
		Dicing Speed: 0.1–300mm/s
5	Z-axis	Effective Travel / Chuck Size: Max 14.7mm / Φ58mm	Max Cutting Depth ≤4mm
		Drive: Stepper Motor
		Resolution: 0.0001mm
		Repeat Positioning Accuracy: 0.001mm
		Chuck Sizes: Φ49.4mm ~ Φ54mm
		Max Blade Diameter: Φ58mm
		Max Speed: 90mm/s
6	θ-axis	Rotation Range: Max 380°	-
		Drive: DD Direct Drive Motor
		Repeat Positioning Accuracy: 3 arcsec
		Resolution: 0.0002°
7	Alignment System	Illumination: Coaxial + Ring Light	-
		Magnification: Low 0.75X / High 7.5X
		Minimum Observable Feature: 0.005mm
8	Machine Weight	1800 kg	-
9	Overall Dimension	1580mm × 1260mm × 1750mm (LWH)	-
10	Total Power Consumption	8kW	-

 

Standard Configuration

 

No.	Part Name	Brand	Qty & Unit
1	X-axis Linear Guide	NSK (Japan) (SP Grade)	1 set
2	Y-axis Linear Guide	NSK (Japan) (SP Grade)	1 set
3	Z-axis Linear Guide	NSK (Japan) (SP Grade)	2 sets
4	X-axis Ball Screw	NSK (Japan) (C3 Grade)	1 pc
5	Y-axis Ball Screw	NSK (Japan) (C0 Grade)	2 pcs
6	Z-axis Ball Screw	NSK (Japan) (C0 Grade)	2 pcs
7	DD Direct Drive Motor	NSK (Japan)	1 set
8	X-axis Servo Motor	Panasonic (Japan)	1 set
9	Y-axis Servo Motor	Panasonic (Japan)	2 sets
10	Z-axis Stepper Motor	Mingzhi	2 sets
11	Linear Encoder	Renishaw (UK)	2 sets
12	Pneumatic Components	SMC (Japan)	1 set
13	Spindle	RPS (South Korea)	2 sets
14	Control System	Panasonic (Japan)	1 set

 

Functional Configuration

1. Height measurement loop detection & alarm function

2. Resume dicing from break-point function

3. Chuck dressing function

4. Pre-dicing function

5. Auto-focus function

6. Non-Contact Height Sensing (NCS) function

7. Blade Breakage Detection (BBD) function

8. On-wheel blade dressing function

9. Supports cutting for rectangular and circular workpieces

10. Automatic & semi-automatic cutting modes available

11. Unidirectional & bidirectional cutting modes available

12. Pause for inspection at any time during operation

13. Chinese operation interface, supports storage of multiple processing files

14. Full-process real-time micro compensation for temperature errors

15. Alarm & protection against insufficient air pressure, water pressure and flow rate

16. Process programming for complex workpiece cutting

17. Automatic image recognition function

18. Auto loading/unloading mechanism with static elimination device

19. Two-fluid centrifugal cleaning machine equipped with static elimination device

20. GM communication system (Optional)

Operating Environment

 

1. Ambient Temperature

HY-WD802 dicing saw shall be installed in an environment maintained at around 23°C, ideally a constant-temperature clean room for stable wafer cutting performance of this HY-WD802 wafer dicing machine.

2. Power Supply

Single-phase 380V, 8KW power input is required for the HY-WD802 dicing saw.

3. Compressed Air

For the HY-WD802 semiconductor cutting equipment, compressed air with filtration precision of ≥0.01μm / 99.5% purity with refrigerated dryer dehumidification is mandatory. Operating air pressure range: 0.6–0.8 MPa. Air consumption: 200L/min for spindle only, total 400L/min for the full HY-WD802 dicing saw.

4. Cutting Water

The cutting water system of the HY-WD802 wafer dicing machine needs temperature controlled at room temperature ±2°C, working pressure 0.2–0.4 MPa. Tap water is acceptable; wastewater can be discharged directly after treatment. Water consumption rate: 5L/min.

5. Cooling Water (Spindle Cooling)

The spindle cooling circuit of HY-WD802 dicing saw adopts purified water circulation supply. Cooling water temperature should be kept at room temperature ±2°C with working pressure 0.2–0.4 MPa.

6. Surrounding Environment

Place the HY-WD802 semiconductor dicing machine away from blowers, air vents, high-temperature units and oil mist-generating equipment to prevent interference with precision wafer cutting.