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Fully Automatic Eutectic Die Bonder

1 results found for "Fully Automatic Eutectic Die Bonder"
  • Semiconductor Eutectic Bonding Machine
    Fully Automatic TO Packaging Eutectic Die Bonder Compatible with TO56/TO9/TO38
    HY-EBT505 is a dedicated eutectic device for TO packaging, compatible with TO56, TO9 and TO38 bases, enabling simultaneous eutectic bonding of two components on one single base. Equipped with visual positioning, linear motor manipulator and constant-temperature eutectic stage with nitrogen protection, as well as assembly line loading/unloading and vacuum pick-up detection structure, it delivers high mounting accuracy and stable process, simplifies packaging procedures and improves production efficiency and finished product yield.
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