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HY-EBT505 is a dedicated eutectic device for TO packaging, compatible with TO56, TO9 and TO38 bases, enabling simultaneous eutectic bonding of two components on one single base. Equipped with visual positioning, linear motor manipulator and constant-temperature eutectic stage with nitrogen protection, as well as assembly line loading/unloading and vacuum pick-up detection structure, it delivers high mounting accuracy and stable process, simplifies packaging procedures and improves production efficiency and finished product yield.
Brand :
HYRNUSItem No. :
HY-EBT505Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic TO Packaging Eutectic Die Bonder Compatible with TO56/TO9/TO38
Product Introduction
HY-EBT505 Fully Automatic TO Packaging Eutectic Die Bonder is a dedicated eutectic device designed for TO packaging production lines. It is compatible with TO56, TO9 and TO38 bases and supports simultaneous eutectic bonding of two components on a single base to streamline packaging workflow. The machine adopts a marble steel composite frame driven by linear motors, delivering outstanding positioning precision and stable long-term operation. Equipped with multi-station visual positioning system, linear motor manipulators, constant-temperature eutectic stage with nitrogen protection, assembly line loading & unloading mechanism and vacuum pick-up detection unit, the equipment achieves ultra-high mounting accuracy and consistent processing performance throughout mass production. All built-in calibration stages for submount and die offer real-time angle compensation for materials, effectively lowering manual adjustment frequency. It greatly simplifies complex packaging procedures, significantly boosts production efficiency and raises the finished product yield for standardized TO packaging manufacturing.
Component List
| No. | English name |
| 1 | Microscope Mechanism |
| 2 | Heat Sink Search CCD1 |
| 3 | Heat Sink Pick-up Manipulator |
| 4 | Heat Sink Front Side Alignment CCD2 |
| 5 | Heat Sink Mounting Manipulator |
| 6 | Monitoring CCD3 |
| 7 | Eutectic Observation CCD4 |
| 8 | Die Mounting Manipulator |
| 9 | Die Front Side Alignment CCD5 |
| 10 | Die Search CCD6 |
| 11 | Die Pick-up Manipulator |
| 12 | Keyboard Console |
| 13 | Die & Wafer Mechanism |
| 14 | Die Alignment Mechanism |
| 15 | Socket Fixture Loading & Unloading Mechanism |
| 16 | Eutectic Stage |
| 17 | Flip Fingers |
| 18 | Socket Pick-up Manipulator |
| 19 | Heat Sink Alignment Mechanism |
| 20 | Heat Sink & Wafer Mechanism |
Product Features
1. The HY-EBT505 is special production equipment designed to heat-bond submounts onto TO bases, compatible with TO56, TO9 and TO38 specifications.
2. It supports simultaneous eutectic bonding of two components on a single base, simplifying packaging processes and boosting finished product yield.
3. Submounts are fed via dicing blue film with independent identification, pick-and-place and calibration functions. TO bases adopt assembly-line loading and unloading to elevate overall production efficiency.
4. Materials are positioned via visual recognition with position and angle compensation to guarantee high bonding accuracy.
5. The manipulator nozzle adopts vacuum pick-and-place. Flow sensors detect successful material pickup, and a nitrogen vacuum-breaking unit is equipped to ensure production accuracy. It delivers light and stable pickup pressure.
6. The eutectic stage features a constant-temperature structure with stable temperature control and nitrogen protection during operation, securing reliable eutectic bonding results.
7. The X-axis manipulator is driven by linear motors to maintain ultra-high precision while improving production efficiency.
Main Component Overview
| Component Name | Description |
| 1. Main Frame | Adopts marble & steel composite base, with linear motor driving for X-axis. Positioning accuracy reaches 2μm and repeatability ±0.5μm. Equipped with 4 groups of independent manipulators to separately complete submount picking & bonding, die picking & bonding. It delivers stable operation and outstanding processing precision. |
| 2. Pick & Bond Mechanism | Divided into picking and bonding modules. Bonding nozzle with rotary mechanism performs secondary angle correction during bonding. Bakelite die nozzle supports adjustable bonding pressure from 20g to 100g for flexible lamination and die protection. |
| 3. Wafer Stage | Compatible with 6-inch wafer ring, integrated with XY motion platform and ejector pin module. Two die separation modes are available: pin ejecting up and blue film stretching down to steadily separate dies from dicing tape. |
| 4. Submount & Die Calibration Stage | The submount calibration stage supports θ rotary correction. The die calibration stage adopts GMT 3-axis XYθ motion system to real-timely compensate substrate angle deviation. Both stages are equipped with pressure sensors to calibrate nozzle pressure. |
| 5. Flip Fingers | Dual-finger clamping structure connects base loading & unloading. Clamps realize 90° flipping function. Flipping and XY axes are fully motor-driven to balance transfer efficiency and positioning precision. |
| 6. Eutectic Stage | Heated tube provides constant temperature with ±5℃ temperature tolerance. Dual cold & hot nitrogen supply isolates oxygen to prevent oxidation of bases and dies under high temperature, with preheating zone to ensure reliable eutectic bonding. |
| 7. Eutectic Stage Working Principle | 1.Feeding fingers deliver base into eutectic stage2.Eutectic stage descends to limit base position3.Ejector rod jacks up, feeding fingers retract4.Compression rod locks base to finish precise positioning |
| 8. Auto Loading & Unloading Module | All stations and Z-axis are driven by stepper motors for smooth movement and accurate positioning. Assembly-line station transfer design, with adjustable track width compatible with multiple material trays. |
| 9. CCD Vision System | Equipped with 4 sets of Hikvision 5MP industrial vision assemblies fitted with 4x zoom lenses and software-adjustable ring & spot light sources, the machine features six CCD inspection stations. These stations independently realize submount searching and correction, die front & backside identification, and real-time eutectic monitoring to greatly enhance bonding and packaging precision. |
| 10. Base Transfer Manipulator | Dual YZ-axis linkage realizes high-speed & high-precision transfer. Nozzle integrates buffer structure and SMC vacuum detection sensor, triggering buffer alarm if base pins jam to avoid material damage. |
Technical Specifications
| Item | Specification |
| Equipment Dimensions | 1690×1320×1820 mm |
| Weight | 1500 KG |
| Power | 6 KW |
| Air Pressure | 0.4～0.6 MPa |
| Voltage | 220 V |
| Positioning Accuracy | ±10 µm |
| Angle Accuracy | ±1° |
| Die Bonding Pressure | 10～50 g |
| Wafer Size | 6" |
| Eutectic Stage | 1 set (compatible with TO56, TO9, TO38) |
| Die Size | 0.2～1 mm |
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