HY-BI300 Aoi Equipment is a fully automatic 2D AOI inspection system engineered for semiconductor back-end quality assurance, addressing wire bonding and die surface defects across SIP, COB, IC, power devices, optical communication, and LED packaging applications.
Read More
leave a message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
