Fully Automatic Chip Appearance Inspection System for semiconductor packaging

HY-BI300 Wire Bonding & Chip Appearance Inspection Machine delivers 100% full coverage with 3.2 μm pixel precision and ±2 μm detection accuracy, identifying wire breakage, missing bonds, ball offset, cold joints, cross-wire shorts, and die surface anomalies including scratches, chipping, contamination, and adhesive residue. The proprietary point cloud algorithm overcomes imaging barriers in cross-wire and large depth-of-field scenarios, while multi-layer image acquisition with wire width percentage detection establishes a closed-loop data chain from real-time inspection to process optimization. Supporting both standalone offline and in-line configurations, the HY-BI300 integrates seamlessly with upstream die bonding, wire bonding, and singulation processes, functioning as a critical yield safeguard for automotive electronics and industrial-grade manufacturing. The RGB multi-channel light source and ultra-depth-of-field fusion technology ensure reliable detection on complex topography. With guided programming, AI-assisted inspection algorithms, and comprehensive production data traceability, this AOI system reduces labor dependency, accelerates defect identification, and delivers measurable improvements in first-pass yield for high-reliability semiconductor assembly lines.

Application Scenarios

Lines requiring only 2D visual inspection: Standard wire bonding processes and general Memory/IC lead bonding processes

Applications requiring high UPH, cost-sensitive, and with low 3D inspection requirements

Key Algorithm & Performance Features

Point cloud algorithm overcomes imaging challenges in cross-wire and large depth-of-field scenarios. Multi-layer image acquisition and wire width percentage defect detection are implemented to establish a seamless data link, forming a full-process closed-loop management of "real-time inspection – precise analysis – process optimization".

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High-Speed Flying Capture

Ultra-Deep Focus Synthesis

High-Precision 3D Inspection

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AI-Assisted Programming

 

Product Features

This system detects wire bonding defects including cross-wire short circuits, abnormal wire loops, broken wires, ball offset, cold joints, uneven wire diameter, and re-bond issues, while also identifying die surface defects such as scratches, chipping, foreign particles, adhesive residue, cracks, and poor or missing marking, as well as package substrate defects including pad oxidation, contamination, and dimensional deviation.

It overcomes single-layer cross-wire inspection limitations with multi-layer algorithms and wire width percentage-based defect detection, while the self-developed point cloud algorithm combined with ultra-depth-of-field fusion technology ensures reliable inspection in cross-wire and large-depth-of-field scenarios. The system delivers superior precision and frame rate compared to traditional 3D line-scan technology, supports both standalone offline and in-line production modes for flexible integration, and features a portable, user-friendly interface with guided programming for quick recipe setup.

Key Specifications

Item	Details
Pixel Precision	3.2 μm
Field of View (FOV)	22 mm × 22 mm
Depth of Field	200 μm
2D Inspection Accuracy	±2 μm
Full Inspection	100%
Loop Height Measurement	±10 μm
Compatible Product Size	50~300 mm (L) × 50~100 mm (W) × 0.1~5 mm (T)
Compatible Magazine Size	60~310 mm (L) × 60~110 mm (W) × 110~170 mm (T)

Parameter Specifications

Item	Parameter
Equipment Name	Wire Bond & Die Appearance Inspection Machine
Model	HY-BI300
2D Precision	3.2 μm
Field of View	22 mm × 22 mm
Detectable Solder Joint Defects	Defect width ≥ 3 Pixel, contrast ≥ 30 bit:No solder joint, solder joint offset, solder joint size, golf ball
Detectable Wire Bond Defects	Defect width ≥ 3 Pixel, contrast ≥ 30 bit:Misaligned wire, missing wire, broken wire, wire offset (serpentine arc), re-bond, horizontal sag, parallel wire, excess tail
Detectable Die Defects	Defect width ≥ 3 Pixel, contrast ≥ 30 bit:Die chipping, die rotation, die missing, corner break, black spot, offset, scratch, foreign matter contamination, adhesive coverage
Substrate Size	50~300 mm (L) × 50~100 mm (W) × 0.1~5 mm (T)
Compatible Magazine Size	60~310 mm (L) × 60~110 mm (W) × 110~170 mm (T)
Equipment Dimensions	950 × 1500 × 1900 mm
Weight	1500 kg ± 5%
Power	2.5 kW

Inspection Items

Wire Breakage	Missing Bond	Scratches	Misalignment / Angular Deviation
Wire Bundling	Bond Pad Misalignment	Cracking	Silver Glue/Epoxy Overflow
Wire Collapse	Abnormal Ball Diameter	Oxidation	Chipping
Abnormal Wire Arc	Chip Appearance Defects	Contamination	Missing Chip

Product Details

 

FAQs

What is the maximum substrate size and thickness the HY-BI300 can handle?

The HY-BI300 accommodates substrates from 50 mm to 300 mm in length, 50 mm to 100 mm in width, and thickness ranging from 0.1 mm to 5 mm. Compatible magazine sizes span 60–310 mm in length, 60–110 mm in width, and 110–170 mm in height, ensuring broad compatibility across standard semiconductor packaging formats.

How accurate is the HY-BI300's 2D inspection?

The system delivers 3.2 μm pixel precision with ±2 μm 2D inspection accuracy, detecting defects as small as 3 pixels in width with a minimum contrast threshold of 30 bits. This level of precision ensures reliable identification of micro‑scale wire and die surface anomalies critical for automotive and industrial‑grade quality standards.

Does the HY-BI300 support both offline and in-line production modes?

Yes, the HY-BI300 operates in either standalone offline batch inspection mode or fully integrated in‑line configuration. It interfaces seamlessly with upstream die bonding and wire bonding equipment and downstream singulation processes, functioning as a turnkey quality control node without disrupting existing production workflows.