HY-XR5010(2.5D) Series performs non-destructive testing for IC packaging, BGA/QFN chips, PCBA and capacitors. Equipped with CNC motion, multi-angle imaging and one-click void analysis, it detects voids, solder faults and dimensional errors. Three models fit small-batch checks, production sampling and lab R&D; optional barcode tracking and a high-res detector spot defects as tiny as 4μm.
Full enclosed lead shielding limits radiation below 1μSv/h, with complete official radiation safety certifications.
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