HY-EL25H is a laboratory plasma treatment system widely adopted by research institutes, corporate R&D departments and small-batch pilot production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a square stainless steel vacuum chamber, plasma generator, vacuum pump and gas inlet & exhaust ports.
It effectively enhances substrate surface adhesion and improves surface hydrophilicity, with extensive applications in material bonding, coating, substrate film deposition and wafer bonding. This equipment delivers stable, repeatable plasma treatment for semiconductor, microfluidic and new material research projects.
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