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HY-EL25H is a laboratory plasma treatment system widely adopted by research institutes, corporate R&D departments and small-batch pilot production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a square stainless steel vacuum chamber, plasma generator, vacuum pump and gas inlet & exhaust ports.
It effectively enhances substrate surface adhesion and improves surface hydrophilicity, with extensive applications in material bonding, coating, substrate film deposition and wafer bonding. This equipment delivers stable, repeatable plasma treatment for semiconductor, microfluidic and new material research projects.
Brand :
HYRNUSItem No. :
HY-EL25HOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaLaboratory 25L Vacuum Plasma Cleaning Machine with 7-inch PLC Touch Screen
Product Introduction
The NE-PE25H Vacuum Plasma Cleaning Machine is ideal for university research labs, enterprise R&D centers and small-batch manufacturing. Equipped with a square stainless steel vacuum chamber built with military-grade welding, integrated dual-layer electrodes, dual independent gas channels and a front-opening structure with rear exhaust circulation, the machine realizes uniform gas intake and excellent corrosion resistance. Its user-friendly touchscreen supports real-time parameter monitoring, multi-group storable process recipes with full data traceability, and eliminates the need for an extra gas mixer for diverse gas ratio testing.
This plasma system greatly boosts substrate adhesion and hydrophilicity, delivering stable, repeatable treatment for core processes including organic contamination cleaning, surface hydrophilic/hydrophobic modification, precision micro-etching, PDMS microfluidic chip bonding and photoresist ashing. It is widely adopted in material bonding, coating, substrate film deposition and all kinds of semiconductor new material research projects.
Product Application
1. Cleaning: Remove organic residues, oxides, metal salts and nanoscale particulate contaminants.
2. Activation: Adjust hydrophilic/hydrophobic properties, raise surface energy, graft functional groups and improve biocompatibility.
3. Etching: Surface patterning, micro-etching and controllable adjustment of surface morphology & roughness.
4. Bonding: Hermetic bonding for PDMS and other microfluidic chips.
5. Photoresist Stripping: Photoresist ashing and removal of bottom anti-reflective coating.
Product Features
1. Stainless steel vacuum chamber processed with military-grade welding, featuring superior sealing performance and excellent corrosion resistance.
2. Built-in two layers of electrodes and multi-layer processing trays to greatly improve space utilization.
3. User-friendly touchscreen interface displaying real-time process parameters.
4. Supports storage of multiple process recipes for one-click recall, with fully traceable operation data.
5. Equipped with dual independent gas channels; no additional gas mixer required, convenient for testing various gas ratio formulations.
6. Front-opening door plus rear exhaust design forms internal dynamic gas circulation. Uniform air intake delivers consistent cleaning results.
Machine Outline Drawing and Vacuum Chamber Diagram
Technical Specifications
| No. | Category | Specification Item | Parameter |
| 1 | Plasma Generator | Power | 0–1000W, continuously adjustable |
| Frequency | 40 KHz | ||
| 2 | Vacuum Reaction Chamber | Chamber Material | Imported 316 mirror stainless steel with military-grade sealing |
| Chamber Volume | 380(W)×390(D)×170(H) mm; 25L | ||
| Effective Processing Space | 333(W) × 320(D) mm | ||
| 3 | Discharge Electrodes | Electrodes | 3 pieces of special high-conductivity aluminum alloy electrodes |
| Processing Layers | 2 layers | ||
| Discharge Mode | CCP capacitive coupled plasma reaction discharge | ||
| Positive & Negative Electrode Spacing | 50 mm | ||
| Tray Clearance | 30 mm | ||
| 4 | Gas Path Control | Mass Flow Controller | 300 SCCM |
| Gas Circuit Design | Dual-side uniform air intake design for consistent cleaning & etching results | ||
| Gas Channels | 2 gas lines, compatible with O₂, Ar, N₂, H₂, etc. | ||
| (Notify us in advance if corrosive gas is required) | |||
| 5 | Vacuum Measurement | Vacuum Measuring System | Measuring range: 5×10⁻² ~ 1.0×10⁵ Pa |
| Measuring accuracy: 0.1 Pa | |||
| 6 | Pumping System | Vacuum Pump | 16 m³/h |
| Vacuum Pipeline | Stainless steel tubing + pneumatic valves | ||
| 7 | Control System | Control Mode | PLC |
| Touch Screen | 7-inch touch panel | ||
| Software Program | Self-developed patented plasma control system | ||
| 8 | Site Conditions | Power Supply | 220V, 50/60Hz, 13A |
| Gas Pipe Connector | Φ6 mm | ||
| Required Gas Purity | 99.99% | ||
| Inlet Gas Pressure | 0.3–0.6 MPa | ||
| Exhaust Port | KF25 flange | ||
| 9 | Overall Machine Specs | Overall Dimensions | 650mm(L) × 649mm(W) × 666mm(H) |
| Net Weight | 80kg | ||
| Total Power Consumption | 3 KW |
Operating Environment (Items to be Prepared by Customer)
| No. | Item | Requirements |
| 1 | Power Supply & Grid Condition | Input: 220V, 50/60Hz; allowable grid fluctuation ±10%. The protective earth wire shall comply with international standards. No strong electromagnetic interference near the equipment installation area. |
| 2 | Installation Ambient Conditions | Ambient temperature: 0–40°C; Relative humidity: 15%–60%. |
| 3 | Gas Source Preparation | Gas cylinders of oxygen, argon, nitrogen, hydrogen, etc. (must be equipped with pressure reducing valves). Inlet gas pressure > 0.3 MPa; Gas fitting diameter: Φ6 mm. |
| 4 | Exhaust Duct | Connect to the exhaust port of vacuum pump (mandatory for cleanroom applications). |
Product Details
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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