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Precision Semiconductor Encapsulation Mold

1 results found for "Precision Semiconductor Encapsulation Mold"
  • MGP Molding Die
    MGP Molding Mold for SMA SMB SMC
     HY-PMS03 MGP molding mold fits SMA, SMB, SMC surface mount diodes and works with 400T+ molding presses. Each package has 4 mold boxes to form 8 lead frames at once. With quick swap mold boxes and chrome-coated wear-resistant alloy cavities, it reaches 200,000 shots. Plastic offset ≤0.05mm avoids overflow, bubbles and voids for steady mass production.
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Contact us:allen@hyrnus.com