MGP Molding Mold for SMA SMB SMC

Product Introduction

HY-PMS03 MGP Molding Mold is a multi-cylinder plastic encapsulation mold customized for discrete semiconductors, suitable for SMA, SMB, SMC DO-214 series surface mount diodes. Unlike traditional single-cavity molds, it supports simultaneous molding of multiple lead frames, solving typical drawbacks such as low output, cumbersome mold change, large dimensional tolerance deviation and short service life.

All internal and exterior quality standards meet global semiconductor packaging requirements. Standard molding parameters: mold temperature 160~180℃, injection pressure 1000~1600psi, injection time 8~25s. It is designed for mass packaging of TVS diodes, fast recovery diodes and rectifier bridges.

Product Application

Quality Control & Acceptance Standard of MGP Molding Die

The following complete quality acceptance criteria apply to finished semiconductors produced by the HY-PMS03 MGP molding mold, a precision semiconductor encapsulation mold dedicated to SMA, SMB, SMC DO-214 surface mount diodes. It covers dimensional tolerance, surface defect limits, internal void control, mold cavity coating service life, and stable mass production benchmarks after 100,000 molding cycles or one year of continuous operation, fully matching global packaging & test factory standards.

Note: All measurement units in the table are millimeters (mm) unless otherwise marked.

Item No.	Inspection Item	Acceptance Standard	Standard after 100,000 Shots / Within 1 Year
1	Overall dimension: Length × Width × Thickness	Follow the drawing of encapsulated products	-
1.1	Top length, top width & top thickness	Follow the drawing of encapsulated products	-
1.2	Bottom length, bottom width & bottom thickness	Follow the drawing of encapsulated products	-
1.3	Lead frame thickness	Follow the drawing of encapsulated products	-
2	Appearance Specifications
2.1	Surface roughness Ra	Follow the drawing of encapsulated products	-
2.2	Upper draft angle	Follow the drawing of encapsulated products	-
2.3	Lower draft angle	Follow the drawing of encapsulated products	-
2.4	Mold cavity surface treatment	Hard chrome plating	-
3	X & Y Direction Offset Tolerance
3.1	Random offset of upper & lower plastic body	≤0.05mm	-
3.2	Offset between plastic body center and lead frame center	≤0.05mm	-
4	Flash residue at runner vent end	Will not hinder automatic downstream equipment transmission	Will not hinder automatic downstream equipment transmission
5	Thin flash residue thickness at plastic body vent end	Will not hinder automatic downstream equipment transmission	Will not hinder automatic downstream equipment transmission
6	Flash residue separated from feed inlet (outward from root)	Will not hinder automatic downstream equipment transmission	Will not hinder automatic downstream equipment transmission
7	Uplifted flash residue at feed inlet (upward from border)	Zero flash residue	Zero flash residue
8	Device pins	No flash on pin surface; transparent flash ≤1.0mm if exists	-
9	Mold release performance	Smooth demolding; no runner/cull fracture during ejection	Smooth demolding; no runner/cull fracture during ejection
10	Standard Molding Parameters for Acceptance Test
10.1	Mold temperature	160~180℃	-
10.2	Injection pressure for molding compound	1000~1600psi	-
10.3	Injection time	8~25s	-
11	Surface Defect Control
11.1	Cavity scratch marks visible on finished parts	None allowed	-
11.2	Wavy traces on cavity surface visible on finished parts	None allowed	-
11.3	Max size of air bubbles on plastic body surface	＜0.1mm	-
11.4	Max size of pinholes on plastic body surface	＜0.1mm	-
11.5	Cracks & chipped corners on plastic body	None allowed	-
11.6	Smoke-shaped flash on ejector pin top edge	Zero flash residue	-
11.7	Vertical thin-edge flash at insert joint surface	≤0.05mm	≤0.05mm
12	Flash overflow thickness & width at central compound cake residue	≤0.05mm	Thickness＜0.05mm, Width＜2mm
13	Flash overflow thickness & width on both sides of runner	≤0.05mm	Thickness＜0.05mm, Width＜1mm
14	Lead frame deformation & positioning hole cracking after ejection	Not allowed	Not allowed
15	Internal Defect Control
15.1	Void size above chip pad & under die island	None allowed	-
15.2	Void quantity above chip pad & under die island	None allowed	-
15.3	Delamination above chip pad & under die island	Not allowed	-
15.4	Void size at other internal plastic positions	≤0.1mm	-
16	Incomplete filling	Not allowed	-
17	Mold cavity coating service lifespan	Over 150,000 shots for green compound; Over 200,000 shots for normal compound, no coating peeling	-

 

MGP Molding Die Configuration & Technical Specifications

The table below lists the complete hardware configuration specifications of the HY-PMS03 MGP molding die, a dedicated semiconductor encapsulation mold for SMA, SMB, SMC DO-214 surface mount diodes. It covers mold frame structure, core material grades, temperature control system, thermal protection, compatibility with molding presses, interchangeable mold box design and other key mechanical parameters, fully meeting the production demands of semiconductor packaging & test factories.

Item No.	Configuration Item	Technical Standard
1	Mold Main Body Compatibility	The mold fits molding presses with a clamping force above 400 tons; the mold frame supports up to 4 mold boxes with quick-replace mold box structure.
2	Injection System Design	Bottom-up multi-barrel injection structure; driven by built-in high-temperature leak-proof hydraulic cylinders with balanced injection head drive plate.
3	Interchangeability of Mold Boxes	All mold boxes are fully interchangeable on the mold frame without fixed position restrictions.
4	Interchangeability of Internal Components	All spare parts inside mold boxes are universally replaceable.
5	Ejector Mechanism of Mold Box	Built-in ejector pin plate structure, slide rail extraction design for fast mold box replacement.
6	Mold Box & Component Material Hardness Standard	1. Mold box: DC53, HRC59~60
		2. Cavity & inserts: ASP23, HRC61~63
		3. Center block: ASP23, HRC61~63
		4. Injection barrel: ASP23
		5. Injection head: Tungsten steel
7	Lead Frame Loading Rack	High-strength lightweight aluminum alloy loading rack with floating support design for smooth lead frame feeding without jamming.
8	Cavity Surface Roughness	Surface roughness complies with drawing requirements of encapsulated semiconductor products.
9	Multi-point Temperature Control System	Thermocouple holes beside each heating rod for independent temperature control (max 24 temperature control points); 4 extra thermocouple ports on front/rear mold frame for 2/4 zone temperature molding presses.
10	Over-temperature Cut-off Protection	Over-temperature induction switch mounting holes on upper & lower mold frames to match press thermal protection modules.
11	Air Float Base of Lower Mold Frame	Air float function on lower mold base for convenient mold installation.
12	Mold Frame Fixing Structure	L-shaped pressing plate design, compatible with different molding press platforms.
13	Fastener Standard	All screws and nuts adopt metric standard.
14	Hydraulic Joint Bracket Design	Slide rail quick assembly & locking structure for injection head drive plate connectors.
15	Heating Rod Temperature Uniformity	Temperature difference between upper and lower mold surface controlled within ±5℃.
16	Heating Tube Marking	Clear power label at the root of each heating tube.
17	Heating Tube Fastening Bracket	Fixed clamps reserved around each heating tube hole.
18	Thermal Insulation Cover	Fixed insulation cover for upper mold; quick detachable insulation plates on both sides of lower mold.
19	Heat Insulation Plate Performance	Heat insulation plates resist long-time clamping impact without deformation or mold surface defects.
20	Heating Rod Identification	Each heating rod marked with rated power and working voltage.
21	Thermocouple Interface	Matches customer’s molding press, supports 2-point, 4-point and 24-point temperature control.
22	Thermal Protection Interface	Compatible with thermal protection modules of mainstream plastic encapsulation presses.
23	Press Plate Structure	Standard structure matching customer’s molding press.
24	Thickness of Upper & Lower Mold Plates	Thickness of each mold plate ≥ 40mm.
25	Press Plate Locking Method	Press plates tightly locked onto mold plates.
26	Press Plate Screws	Matches screw specification of customer’s plastic encapsulation molding press.
27	Ejector Pin Layout	Ejector pin positions customized according to mold layout.
28	Mold Table Dimension	Customized based on customer’s press platform size.
29	Mold Air Float Interface	Reserved air float connector for mold lifting and installation.
30	Hydraulic Oil Pipe Interface	Matches standard oil pipe joints of molding presses.
31	Mold Cavity Layout Drawing	Refer to product encapsulation drawing.
32	Total Mold Thickness After Clamping	Total mold thickness after clamping exceeds 520mm per standard design.