Ultrasonic Wire Bonding Machine For Laboratory

HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.

Brand :
HYRNUS
Item No. :
HY-WB2000
Order(MOQ) :
1 Set
Warranty :
One-Year Warranty and Lifetime Maintenance
Payment :
T/T
Lead Time :
7-35 Days
Product Origin :
China

Inquiry Now

Ultrasonic Wire Bonding Machine For Laboratory

Product Introduction

HY-WB2000 ultrasonic wire bonder is a high-precision bonding machine designed for microelectronic packaging and chip interconnection. Using fine aluminum wire, bonding pressure, and ultrasonic energy, it creates strong and reliable connections between aluminum wire and substrate pads, enabling electrical interconnection between chips and substrates as well as signal transmission between chips. It is widely used in microwave devices, RF modules, hybrid circuits, MEMS circuits, optoelectronic devices, sensors, nano devices, semiconductor devices, radar devices, military components, special-purpose circuits, COB/SOB packaging, and other high-reliability electronic applications.

Product Features

*Vertical guide rail Z-axis movement ensures stable bonding head motion and precise bonding control.

*Y-axis horizontal guide rail controls the second bond span for accurate wire positioning.

*Imported stepper motors drive both Z-axis and Y-axis movements for smooth operation and high repeatability.

*First bond height, second bond height, loop height, and wire span can be digitally controlled.

*Provides stable bonding quality, accurate bond point control, and high wire bonding consistency.

*Consistent loop height helps meet high-reliability microelectronic packaging requirements.

*The second bond point supports automatic bonding for easier operation.

*Operators can complete the bonding process by pressing one button after setting the parameters.

*Faster bonding speed helps improve production efficiency and single-shift output.

Application Fields

Microwave devices, RF modules, hybrid circuits, MEMS circuits, optoelectronic devices, sensors, nano devices, semiconductor devices, radar devices, military components, special-purpose circuits, COB/SOB packaging, etc.

Applicable Industries

*Optoelectronic companies

*Discrete electronic component manufacturers

*Research institutes

*University laboratories

*R&D and production organizations

Technical Parameter

Bonding Head	Aluminum Wire Diameter	0.7 mil–3.0 mil / 18 μm–75 μm
	Corresponding Wedge Tool	Outer diameter Φ1.6 mm, length 21 mm
	Bonding Angle	45°
	Wire Span	0–10 mm, stepper motor, digitally adjustable
	Bonding Loop Height	0–6 mm, digitally adjustable
Ultrasonic System	Ultrasonic Channels	2 channels
	Ultrasonic Power	0–5 W, continuously adjustable
	Bonding Time	5–200 ms ±5% / 20 ms per step
	Ultrasonic Frequency Adjustment	61 kHz ±1 kHz, automatic tracking
	Bonding Pressure Adjustment Range	10–60 g, 2 channels, electromagnetic adjustment
X-Y-Z Worktable	Round Worktable Diameter	125 mm
	Bonding Area	20 × 20 mm
	Mouse-Type Control Handle	20 × 20 mm
	X-Y Minimum Movement	0.1 mil, adjustable
	Z Minimum Movement	0.1 mil, adjustable
	Accuracy Control	0.1 mil, under normal skilled operation
Machine Parameters	Power Supply	AC 220 V ±10%, 50 Hz, 60 W
	Machine Weight	36 kg
	Overall Dimensions	600 * 560 * 390 mm, L * W * H
	Machine Color	Blue
	Microscope Magnification	Two-step magnification: 15× and 30×, standard configuration

Optional HD Camera and Monitor Specifications

Embedded system with FPGA + ARM architecture, running Linux 3.10 operating system.
Dual-core Cortex-A9 processor, 1 GHz main frequency, with up to 1 GB DDR3 memory.
Equipped with a 1/2-inch back-illuminated CMOS sensor.
High-speed image acquisition up to 2 MP, with 1920 × 1080 @ 60 fps resolution.
Two USB ports for connecting a wireless mouse or keyboard.
HDMI HD interface ensures clear and bright image display.
New user interface for more intuitive and convenient operation.
Popular flat button design, attractive and easy to use.
Advanced highlight suppression function effectively reduces strong reflection.
Supports Simplified Chinese, Traditional Chinese, and English language selection.
Monitor size: 24 inches.