The HY-WB900 Deep Access Wedge Wire Bonder is designed for chip-to-pin interconnection in advanced electronic component packaging. It supports hybrid circuits, COB, MCM, MEMS, RF, optoelectronic and automotive modules, featuring real-time bonding deformation monitoring, ultrasonic energy feedback, precise loop control and consistent tail wire management.
The HY-WB900 Deep Access Wedge Wire Bonder is suitable for the internal pin interconnection process of chips in the production of special electronic components and is one of the key pieces of equipment in electronic component packaging. It is mainly used in hybrid circuits, COB modules, MCMs, MEMS devices, RF devices/modules, optoelectronic devices, microwave devices, military devices, high-end optoelectronic devices, automotive electronic modules, and other electronic components.
Features
No.
Feature
1
Automatic real-time bonding deformation monitoring, providing direct welding status feedback control
2
Real-time ultrasonic energy monitoring, providing welding energy feedback control
3
Constant length and constant height loop control capability
4
Piezoelectric motor tail wire control mechanism, ensuring tail wire consistency
5
Compatibility with 19mm and 25mm capillaries
6
High-definition bond head maintenance image auxiliary tool
Technical Specifications
No.
Parameter
Specification
1.
Bonding Accuracy
±3 μm @ 3σ
2.
Bonding Force
0~220 g
3.
Bonding Area
X: 305 mm, Y: 457 mm
4.
Capillary Length
19 mm, 25 mm
5.
Z Travel Range
40 mm
6.
Wire Types
Gold wire (18~75 μm), Aluminum wire (18~75 μm)
7.
P Rotation Range
±220°
8.
Bonding Speed
≥ 4 wires/s
9.
Loop Control
Fully programmable
10.
Spool Size
2 inch
11.
Ultrasonic Range
0~4 W control accuracy, stepped flexible application capability
12.
Workholder Temperature Range
Room temperature ~ 250°C
13.
Cavity Depth Range
Max. 16 mm
14.
Operating System
Windows 10
Terms of use
No
Item
Requirements
1.
Footprint (W×D×H)
≤1000 × 1500 × 1700 mm (excluding monitor space)
2.
Equipment Weight
Approx. 1200 kg
3.
Ambient Temperature
Normal room temperature (20°C ~ 26°C); high temperature operation will affect equipment service life
Vibration may affect equipment accuracy; keep away from vibration sources
7.
Grounding
Must be properly grounded. Follow local regulations for grounding specifications.
8.
Others
- Ensure power supply is located near the machine
- Precision leveling with a leveling instrument is required after installation on site
- Do not use the machine in areas with strong noise, vibration, high heat, or oil contamination
- Avoid installing the machine near cooling fans, ventilation ports, or sources of oil contamination
9.
Voltage
220V ± 10%
10.
Frequency
50/60Hz
11.
Grounding
Must be grounded
12.
Power
≤ 500W
13.
Interface Specification
5A, Single-phase 3-wire
Product Details
FAQs
What is the HY-WB900 deep access wire bonder used for?
The HY-WB900 is used for internal chip interconnection in special electronic component packaging. It is suitable for hybrid circuits, COB modules, MCMs, MEMS devices, RF modules, optoelectronic devices, microwave devices, automotive electronic modules, and other high-reliability electronic components.
What is the main advantage of a deep access wire bonder?
A deep access wire bonder is designed for devices with deeper cavities or complex package structures. It allows stable wire bonding in areas that are difficult to reach with standard wire bonders.
What bonding method does thia machine support?
The HY-WB900 is designed for deep access 90° wedge bonding, making it suitable for special packaging structures and applications that require stable wedge bonding performance.
What wire materials and wire diameters are supported?
The machine supports gold wire and aluminum wire, with a wire diameter range of 18–75 μm.
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