Semiconductor Trim and Form Machine

HY-TF110 Semiconductor Post Mold Equipment  is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes. 

HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.