HY-TF200U is specially designed for post-molding lead trimming, forming and separation of semiconductor packaging components. Compatible with SOT, TO, SOP, DIP, IPM, photovoltaic modules & optocouplers. Equipped with full servo drive system, dual magazine non-stop feeding, safety light curtain protection, optional CCD visual inspection and MES networking function, punching speed up to 30–60 SPM, stable high-efficiency mass production solution for IC packaging industry.
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