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HY-TF200U is specially designed for post-molding lead trimming, forming and separation of semiconductor packaging components. Compatible with SOT, TO, SOP, DIP, IPM, photovoltaic modules & optocouplers. Equipped with full servo drive system, dual magazine non-stop feeding, safety light curtain protection, optional CCD visual inspection and MES networking function, punching speed up to 30–60 SPM, stable high-efficiency mass production solution for IC packaging industry.
Brand :
HYRNUSItem No. :
HY-TF200UOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic IC Lead Trimming, Forming and Separating Machine with Top Power
Product Introduction
HY-TF200U Fully Automatic IC Lead Trimming, Forming and Separating Machine features a top-mounted power automatic punching system that integrates three core functions: lead trimming, pin forming and single component separation. Developed exclusively for processing excess leads and pins of semiconductor devices post plastic encapsulation, the machine automatically completes lead punching, pin shaping and strip separation in a single cycle.
Fitted with dual non-stop feeding magazines, it supports long-cycle unattended continuous mass production. Operators only need to replenish raw materials and collect finished products at regular intervals. It serves as a reliable core processing machine for semiconductor packaging, new energy photovoltaic and optocoupler production workshops.
Product Application
Suitable for post-molding trimming, forming and separation of SOT, TO, SOP, DIP, IPM, photovoltaic modules and optocouplers, widely applied in IC packaging, new energy photovoltaic and optoelectronic manufacturing workshops.
Product Features
1. Top-mounted servo punching power system, stable punching force & high forming precision
2. Dual independent magazines, non-stop cyclic feeding to reduce production downtime
3. Dual receiving modes: tube collection or bulk material box for flexible packaging
4. Full servo control for power, mold opening/closing and feeding movements
5. PLC + touch screen control system, simple operation & easy parameter adjustment
6. Complete multi-layer safety protection: safety light curtain, door sensor and emergency stop button
7. Optional CCD visual inspection and MES networking function for intelligent production
Technical Specifications
| Item | Specification |
| System Type | Top-mounted power automatic punching system |
| Application Purpose | Punching, forming and separation of component leads and pins after plastic encapsulation |
| Compatible Package Types | SOT, TO, SOP, DIP, IPM, photovoltaic modules, optocouplers |
| Punching Speed (SPM) | 30~60 strokes per minute |
| Control System | Mitsubishi or Yonghong PLC + Touch Screen + Operation Buttons |
| Main Power System | Servo Motor + Reducer |
| Mold Opening & Closing Mechanism | Servo Motor + Crank Power Box |
| Feeding Mechanism | Servo Motor + Air Cylinder + Pneumatic Floating Bridge Structure |
| Loading Mechanism | Dual Independent Magazines, Non-stop Cyclic Feeding |
| Receiving Mechanism | Automatic Tube Collection / Bulk Tube Material Box |
| Safety Design | Safety light curtain, protective door open sensor, complete safety interlock design & emergency stop button |
| Optional Configuration 1 | CCD Visual Inspection Device |
| Optional Configuration 2 | MES System Networking Function |
Product Details
HY-TF200L adopts dual lower flywheel stamping system for semiconductor post-molding lead frame trimming, forming & singulation, compatible with SOT, TO, SOP and DIP packages. It runs 80–120 strokes per minute with PLC control and full safety interlocks, supporting optional CCD visual inspection and MES system networking. Comes with full series precision mold spare parts, it meets mass IC packaging production requirements.
HY-TF100 is designed for post-mold semiconductor IC lead trimming, pin forming and singulation. Compatible with mainstream miniature packages including SOT, SOD, TSOT and PDFN, it delivers a punching speed of 120–200 SPM. Featuring servo feeding and dual non-stop spring clamps, this equipment significantly boosts throughput of semiconductor packaging lines. It is equipped with complete safety protection as standard, while optional CCD visual inspection and MES networking are available to support smart factory digital management.
HY-TFS210 Lead Cutting Machine is an automatic trim and form system specifically designed for SMA, SMB, and SMC package products. It features a simple structure with stable and reliable performance, a small footprint, fast and stable operation, low noise, and easy operation and maintenance, significantly reducing labor intensity.
HY-TF110 Semiconductor Post Mold Equipment is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes.
HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.
HY-TF210 Trim Roll Former is an automatic trim and form system specifically designed for TO252-6R package products. It delivers a throughput of ≥70k per hour with a punching stroke rate of 50–60 strokes per minute, and features MTBA of ≥40 minutes, MTBF of ≥120 hours, MTTA of ≤5 minutes, and downtime rate of ≤3%.
HY-DS30K is an high-speed integrated dicing saw developed for post-mold singulation of semiconductor molded substrates. It supports an integrated processing flow including substrate cutting, cleaning, vision inspection, sorting and tray binning, which greatly improves the production efficiency of standard semiconductor backend packaging processes.
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